Module Equipment Development Engineer

Intel Corporation•Hillsboro, OR
•$115,110 - $219,550•Hybrid

About The Position

As a Module Equipment Development Engineer, you will lead the development and optimization of advanced semiconductor manufacturing equipment and processes, enabling Intel to deliver high-performance devices. Your contributions will directly impact Intel's technological leadership in the semiconductor industry and advance the capabilities of future technologies. This role is in Intel Foundry Technology Development, a group focused on advancing semiconductor process engineering and delivering manufacturing solutions that support Intel product innovation. You will work with global teams to develop technologies for leading-edge devices in a competitive, fast-paced market.

Requirements

  • Bachelor's degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related STEM field and 4 or more years of industry experience in semiconductor processing; or a master's degree in a relevant STEM field and 3 or more years of domain-specific experience; or a PhD in Materials Science, Chemical Engineering, Physics, Chemistry, or a related STEM field and 6 or more months of experience in semiconductor processing.
  • Industry or domain-specific experience in semiconductor processing, including one or more of the following: proficiency in semiconductor processing techniques such as lithography, etching, thin film deposition, or planarization; expertise in process characterization methods and statistical analysis tools such as JMP, MATLAB, or Python; or familiarity with materials characterization techniques such as SEM, TEM, XPS, or ellipsometry.

Nice To Haves

  • Hands-on experience with equipment troubleshooting, maintenance, or development in collaboration with suppliers.
  • Experience at a semiconductor manufacturing tool supplier.
  • Knowledge of manufacturing technologies including vacuum processes, ALD, or CVD.
  • Strong problem-solving skills and the ability to manage multiple tasks in a fast-paced environment.
  • A collaborative mindset and a proven track record of working across interdisciplinary teams to achieve shared goals.

Responsibilities

  • Develop equipment capable of meeting new process requirements in Dielectrics Thin Films.
  • Develop robust equipment modules that can be transferred seamlessly to high-volume manufacturing.
  • Collaborate with equipment and material suppliers to evaluate, qualify, and implement novel technologies into manufacturing processes.
  • Support technology transfer to high-volume manufacturing through training, audits, and maintaining process consistency across sites.
  • Design, execute, and analyze experiments to optimize advanced manufacturing processes, including material selection, equipment metrology, and parameter tuning.
  • Perform feasibility studies and pathfinding activities to support innovative device architectures and future technology roadmaps.
  • Use advanced data analysis methods, including Statistical Process Control (SPC) and Design of Experiments (DOE), to guide process improvements and enhance yield.
  • Partner with cross-functional teams to ensure seamless process integration and manufacturability.

Benefits

  • Competitive pay, stock bonuses, and benefit programs that include health, retirement, and vacation.
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