Module Development Engineer

Intel•Hillsboro, OR
•Hybrid

About The Position

As a Module Development Engineer at Intel Foundry, you will develop and optimize complex semiconductor manufacturing processes and help integrate innovative device architectures. The work includes designing experiments, analyzing results, and collaborating across scientific and engineering disciplines. Your contributions will support the quality, scalability, and advancement of Intel’s technology roadmap. The role focuses on developing next-generation processes, optimizing manufacturing techniques, and performing pathfinding for future device architectures. You will work with cross-functional teams, equipment and material suppliers, and manufacturing partners to improve process capabilities and support ramp-up to high-volume production using Intel’s Copy Exactly Methodology. This position is based in Hillsboro, Oregon, and is eligible for Intel’s hybrid work model, which allows employees to split time between the assigned site and off-site work.

Requirements

  • Master's degree in a STEM-related field and 5 or more years of semiconductor processing and fabrication experience, or a PhD in a STEM-related field and 3 or more years of semiconductor processing and fabrication experience.
  • Requirements may be obtained through a combination of industry-relevant job experience, internships, and/or schoolwork, classes, or research.

Nice To Haves

  • Proven expertise in thin-film processing or device fabrication with advanced hands-on development experience.
  • In-depth knowledge of film processing methodologies and optimization techniques.
  • Experience leading cross-functional teams and driving complex technical projects to successful outcomes.
  • Familiarity with process control systems, variability sources, and advanced statistical methods.
  • Demonstrated ability to communicate technical concepts effectively in a multidisciplinary environment.

Responsibilities

  • Design, execute, and analyze experiments to develop next-generation semiconductor processes.
  • Develop and optimize advanced manufacturing techniques, including material selection, parameter tuning, and equipment metrology.
  • Perform pathfinding activities to enable innovative device architectures and align them with future roadmaps.
  • Collaborate with cross-functional teams to integrate individual process steps into cohesive manufacturing flows.
  • Partner with equipment and material suppliers to enhance process capabilities and deliver robust solutions.
  • Recommend and implement equipment modifications to improve efficiency, scalability, and consistency.
  • Drive ramp-up to high-volume manufacturing using Intel's Copy Exactly Methodology.
  • Analyze trends in the semiconductor industry and align Intel's technology needs with emerging advancements.

Benefits

  • Competitive pay
  • Stock bonuses
  • Health benefits
  • Retirement benefits
  • Vacation
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