Module Development Engineer

Intel Corporation•Hillsboro, OR

5d•$133,800 - $255,200•Hybrid

About The Position

As a Module Development Engineer at Intel, you will develop and optimize complex semiconductor manufacturing processes, designing experiments and analyzing results to support the integration of innovative device architectures. The work contributes to the quality and scalability of Intel technologies and advances its technology roadmap. You will be part of Intel Foundry, collaborating across scientific disciplines and with cross-functional teams, as well as equipment and material suppliers. The role includes developing advanced manufacturing techniques, supporting pathfinding for future device architectures, improving equipment and processes, and ramping technologies to high-volume manufacturing using Intel's Copy Exactly Methodology.

Requirements

Master's degree in a STEM-related field and at least 5 years of semiconductor processing and fabrication experience, or a PhD in a STEM-related field and at least 3 years of semiconductor processing and fabrication experience.

Nice To Haves

Proven expertise in thin films processing or device fabrication with advanced hands-on development experience.
In-depth knowledge of films processing methodologies and optimization techniques.
Experience leading cross-functional teams and driving complex technical projects to successful outcomes.
Familiarity with process control systems, variability sources, and advanced statistical methods.
Demonstrated ability to communicate technical concepts effectively in a multidisciplinary environment.

Responsibilities

Design, execute, and analyze experiments to develop next-generation semiconductor processes.
Develop and optimize advanced manufacturing techniques, including material selection, parameter tuning, and equipment metrology.
Perform pathfinding activities to enable innovative device architectures and align them with future roadmaps.
Collaborate with cross-functional teams to integrate individual process steps into cohesive manufacturing flows.
Partner with equipment and material suppliers to enhance process capabilities and deliver robust solutions.
Recommend and implement equipment modifications to improve efficiency, scalability, and consistency.
Drive ramp-up to high-volume manufacturing using Intel's Copy Exactly Methodology.
Analyze trends in the semiconductor industry and align Intel's technology needs with emerging advancements.