Module Equipment Development Engineer

Intel•Hillsboro, OR
•Hybrid

About The Position

As a Module Equipment Development Engineer, you will lead the development and optimization of advanced semiconductor manufacturing equipment and processes, enabling Intel to deliver high-performance devices. Your work will contribute to Intel’s technological leadership and advance future technology capabilities. The role is part of Intel Foundry Technology Development, which advances semiconductor process engineering and manufacturing solutions. You will collaborate with global teams to develop technologies that enable leading-edge devices.

Requirements

  • Bachelor’s degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related STEM field, with at least 4 years of industry experience in semiconductor processing; or a master’s degree in a relevant STEM field with at least 3 years of domain-specific experience; or a PhD in Materials Science, Chemical Engineering, Physics, Chemistry, or a related STEM field with at least 6 months of experience in semiconductor processing.
  • Industry experience in semiconductor processing or domain-specific experience, including one or more of the following: proficiency in semiconductor processing techniques such as lithography, etching, thin film deposition, or planarization; expertise in process characterization and statistical analysis tools such as JMP, MATLAB, or Python; or familiarity with materials characterization techniques such as SEM, TEM, XPS, or ellipsometry.

Nice To Haves

  • Hands-on experience with equipment troubleshooting, maintenance, or development in collaboration with suppliers.
  • Experience at a semiconductor manufacturing tool supplier.
  • Knowledge of manufacturing technologies including vacuum processes, ALD, or CVD.
  • Strong problem-solving skills and ability to manage multiple tasks in a fast-paced environment.
  • Collaborative mindset and a proven track record of working across interdisciplinary teams to achieve shared goals.

Responsibilities

  • Develop equipment capable of meeting new process requirements in Dielectrics Thin Films.
  • Develop robust equipment modules that can be transferred seamlessly to high-volume manufacturing.
  • Collaborate with equipment and material suppliers to evaluate, qualify, and implement novel technologies into manufacturing processes.
  • Support technology transfer to high-volume manufacturing through training, audits, and maintaining process consistency across sites.
  • Design, execute, and analyze experiments to optimize advanced manufacturing processes, including material selection, equipment metrology, and parameter tuning.
  • Perform feasibility studies and pathfinding activities to support innovative device architectures and future technology roadmaps.
  • Use advanced data analysis methods, including Statistical Process Control (SPC) and Design of Experiments (DOE), to guide process improvements and enhance yield.
  • Partner with cross-functional teams to ensure seamless process integration and manufacturability.

Benefits

  • Competitive pay
  • Stock bonuses
  • Health benefits
  • Retirement benefits
  • Vacation
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