Module Development Engineer

Intel Corporation•Hillsboro, OR
•$133,800 - $188,890•Hybrid

About The Position

As a Module Development Engineer, you will develop and optimize advanced semiconductor manufacturing processes that support Intel’s high-performance devices. You will design experiments, analyze data, refine process methodologies, and ensure process integration and manufacturability. The work contributes to developing next-generation device architectures and advancing semiconductor manufacturing. The role is part of Intel Foundry Technology Development, which develops manufacturing solutions to support Intel product innovation and device design and production. It is based in Hillsboro, Oregon, and is eligible for a hybrid work model that splits time between the assigned Intel site and off-site work. The stated shift is Shift 1 (United States of America). This is a College Grad position. The minimum qualification is a PhD in a relevant STEM field and at least six months of experience in one or more listed areas. The annual U.S. target compensation range is $133,800 to $188,890. Intel describes its total compensation package as including competitive pay, stock bonuses, and health, retirement, and vacation benefits.

Requirements

  • PhD in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field.
  • At least six months of experience in one or more of the following areas: semiconductor manufacturing techniques such as lithography, etching, thin film deposition, or planarization; process characterization and statistical analysis tools such as MATLAB, JMP, or Python; or materials characterization techniques such as SEM, TEM, XPS, or ellipsometry.

Nice To Haves

  • Experience with advanced device architectures and process integration challenges, such as transistor scaling or selectivity control.
  • Hands-on experience with equipment troubleshooting, maintenance, or development alongside suppliers.
  • Knowledge of manufacturing technologies including vacuum processes, ALD, or CVD.
  • Strong problem-solving skills and the ability to manage multiple tasks in a fast-paced environment.
  • Collaborative mindset and a track record of working across interdisciplinary teams to achieve shared objectives.

Responsibilities

  • Design, execute, and analyze experiments to optimize manufacturing processes for yield, functionality, and efficiency.
  • Develop and sustain semiconductor processing techniques, including material selection, equipment optimization, and metrology system design.
  • Conduct feasibility studies and pathfinding activities to identify solutions for next-generation device architectures.
  • Collaborate with equipment and material suppliers to evaluate, qualify, and integrate new technology solutions into manufacturing workflows.
  • Perform process characterization using Statistical Process Control (SPC), Design of Experiments (DOE), and advanced data analysis tools.
  • Partner with cross-functional teams to support process integration and manufacturability.
  • Support technology transfer to high-volume manufacturing through training, audits, and process consistency across sites.

Benefits

  • Competitive pay
  • Stock bonuses
  • Health benefits
  • Retirement benefits
  • Vacation
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