Intel is hiring a Chemical Mechanical Planarization (CMP) Process Development Engineer within its Logic Technology Development organization. The role develops and sustains planarization techniques for a variety of materials and architectures to support semiconductor miniaturization and integrated-circuit production. CMP work applies concepts from physics, chemistry, materials science, and surface science, and relies on collaboration across scientific disciplines. The engineer designs and analyzes experiments, contributes to intellectual property development, and works with suppliers on equipment and component development. The role also oversees specialized CMP process steps in a complex manufacturing line and transfers technology to manufacturing counterparts around the world. The position is based in Hillsboro, Oregon, and is eligible for Intel’s hybrid work model, splitting time between the assigned Intel site and off-site work. Intel describes a collaborative, supportive environment and offers competitive compensation and financial benefits, including bonuses, insurance, and opportunities to buy or receive Intel stock, subject to eligibility. The company also describes medical plans, wellness programs, amenities, time off, recreational activities, and product and service discounts. The listed annual salary range for U.S. locations is $133,800 to $255,200; individual compensation depends on location and other job-related factors.
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Job Type
Full-time
Career Level
Mid Level