Intel Foundry Module Development Engineer

Intel Corporation•Hillsboro, OR

1d•$133,800 - $188,890•Hybrid

About The Position

Intel Foundry Technology and Development is seeking an engineer for its Lithography team. The role focuses on developing and executing current- and next-generation lithography manufacturing processes. Engineers enable innovative device architectures, demonstrate the manufacturing viability of complex processes, and support high-volume production of revenue products. The engineer designs and executes experiments, analyzes data, works with integrated module partners and industry equipment suppliers, and contributes to the development of novel process flows and intellectual property. The role also supports equipment development and qualification, high-volume manufacturing capacity ramp-up, manufacturing-line operations, and technology transfer to other Intel factories using the Copy Exactly methodology. This is an entry-level, College Grad position based in Hillsboro, Oregon, with a hybrid work model. The listed annual salary range is $133,800–$188,890 USD across US locations.

Requirements

PhD in Chemistry, Physics, Material Science, Chemical Engineering, Nuclear Engineering, Electrical Engineering, Mechanical Engineering, or another science or engineering field involving relevant experimental work; candidates must have the degree or expect to receive it within one year of application.
At least 2 years of experimental laboratory work experience.

Nice To Haves

At least 6 months of academic or other experience in equipment or instrumentation troubleshooting, development, and maintenance.
Familiarity with common ML/AI frameworks and model development, training, testing, and deployment workflows for solving technical problems.
Experience in C# or Python.

Responsibilities

Design and execute experiments and analyze data to develop processes that meet manufacturing engineering specifications, including safety protocols, automation, facility, supply-chain, device-performance, and yield requirements.
Participate in developing intellectual property for novel transistor and interconnect architectures, working with integrated module partners to create and realize novel process flows.
Work with industry partners and equipment suppliers to develop and implement equipment, identify capability shortcomings, propose and evaluate hardware modifications, and implement preventative maintenance for stable process lines.
Install and qualify High Volume Manufacturing capacity at the TD site during the ramp to HVM volumes, and operate the manufacturing line to produce revenue products.
Support technology transfer to other Intel factories through the Copy Exactly methodology, including training and audits of installation and qualification to ensure matched processing across sites.