Intel Foundry Module Development Engineer - CMP

Intel Corporation•Hillsboro, OR
•$133,800 - $255,200•Hybrid

About The Position

Intel’s Logic Technology Development organization develops leading-edge fabrication processes to advance semiconductor manufacturing. The Chemical Mechanical Planarization (CMP) Process Development Engineer develops and sustains planarization techniques for a range of materials and architectures, supporting semiconductor miniaturization and integrated-circuit production. CMP work applies principles from physics, chemistry, materials science, and surface science, with collaboration and shared learning across disciplines. The role includes designing and analyzing experiments, contributing to intellectual property, developing equipment and components with suppliers, and overseeing CMP steps in an integrated manufacturing process. The engineer also transfers technology to manufacturing counterparts at sites around the world. This role is based in Hillsboro, Oregon, and is eligible for Intel’s hybrid work model.

Requirements

  • Bachelor’s degree in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related scientific STEM field, plus 4 or more years of semiconductor industry experience in semiconductor processing and fabrication; or
  • Master’s degree in one of the listed or related scientific STEM fields, plus 3 or more years of semiconductor industry experience in semiconductor processing and fabrication; or
  • Ph.D. degree in one of the listed or related scientific STEM fields, plus 6 or more months of semiconductor industry experience in semiconductor processing and fabrication.

Nice To Haves

  • Experience developing, qualifying, or sustaining semiconductor manufacturing equipment in a high-volume production or technology development environment.
  • Demonstrated expertise in structured problem solving, experimental design, statistical data analysis, and hardware capability improvement.
  • Experience collaborating with cross-functional engineering teams and external suppliers to develop equipment solutions, drive technology transfers, and enable new process capabilities.
  • Ability to rapidly analyze complex process issues and identify a solution path.
  • Ability to work independently and show initiative, and to adapt to evolving priorities.
  • Ability to work effectively in a collaborative, fast-paced environment.
  • Strong communication skills, including the ability to summarize complex data sets for technical and non-technical audiences.

Responsibilities

  • Design, execute, and analyze experiments needed to meet engineering specifications for the process.
  • Participate in the development of intellectual property.
  • Develop equipment and components with suppliers based on research findings; identify shortcomings and propose and evaluate modifications to address issues or enable new capabilities.
  • Oversee unique CMP steps within a manufacturing line involving thousands of steps used to manufacture complex microprocessors.
  • Transfer technology to manufacturing counterparts at sites around the world.

Benefits

  • Competitive salary and financial benefits, including bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards, subject to eligibility.
  • Medical plans, wellness programs, amenities, time off, recreational activities, and discounts on products and services.
  • Competitive pay, stock bonuses, and health, retirement, and vacation benefit programs.
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