Intel’s Logic Technology Development organization develops leading-edge fabrication processes to advance semiconductor manufacturing. The Chemical Mechanical Planarization (CMP) Process Development Engineer develops and sustains planarization techniques for a range of materials and architectures, supporting semiconductor miniaturization and integrated-circuit production. CMP work applies principles from physics, chemistry, materials science, and surface science, with collaboration and shared learning across disciplines. The role includes designing and analyzing experiments, contributing to intellectual property, developing equipment and components with suppliers, and overseeing CMP steps in an integrated manufacturing process. The engineer also transfers technology to manufacturing counterparts at sites around the world. This role is based in Hillsboro, Oregon, and is eligible for Intel’s hybrid work model.
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Job Type
Full-time
Career Level
Senior