Intel Foundry Module Development Engineer – Advanced Wet Etch and Cleans

Intel Corporation•Hillsboro, OR

23h•$133,800 - $188,890•Hybrid

About The Position

Intel Foundry Technology and Development is hiring a research-driven Wet Etch Module Development Engineer to develop advanced wet etch and cleaning processes for semiconductor manufacturing. The role applies chemical kinetics, interfacial surface science, and manufacturing engineering to atomic-layer selective etching, nanoscale surface cleans, advanced drying, wet chemical formulations, and single-wafer wet tool architectures. The engineer will develop and validate processes supporting advanced transistor architectures, backside power delivery, and high-density interconnect scaling. The position combines experimental research, equipment and chemical supplier collaboration, computational modeling, data science, intellectual-property development, and the scale-up of laboratory processes to 300mm manufacturing in Intel fabs. The role is based in Hillsboro, Oregon, and is eligible for Intel’s hybrid work model. The posted annual salary range is $133,800–$188,890, with actual pay depending on location and job-related factors.

Requirements

Ph.D. in Chemical Engineering, Chemistry, Materials Science and Engineering, Electrochemistry, Mechanical Engineering (Microfluidics/Transport Phenomena), Physics, or a closely related discipline; degree must be completed or expected within 12 months.
At least 2 years of hands-on experimental research experience, such as doctoral dissertation research, wet chemical synthesis or etching, aqueous or non-aqueous solution chemistry, electrochemistry, surface functionalization, thin-film interface phenomena, or cleanroom wet-bench processing.

Nice To Haves

Expertise in chemical reaction kinetics, selective wet etching, interfacial surface chemistry, corrosion or passivation mechanisms, or surfactant-assisted cleaning and drying, including Marangoni drying, supercritical CO2, or surface modification.
Hands-on experience with thin-film, surface, and chemical characterization techniques such as ellipsometry, AFM, SEM/TEM, XPS, contact-angle goniometry, FTIR, TXRF, or ICP-MS.
Experience with automated fluidic systems, wet-processing instrumentation design, single-wafer spin hardware, or experimental fluid dynamics and mass-transfer troubleshooting.
Experience using Python, MATLAB, JMP, or machine-learning tools for design of experiments, multivariate statistical analysis, or process automation.
Strong publication record, conference presentations, or filed patent applications demonstrating systematic experimental problem-solving in chemical or materials science.

Responsibilities

Design and execute rigorous design-of-experiments studies to invent, characterize, and validate wet etch, selective removal, and advanced chemical cleaning processes.
Develop processes for advanced transistor architectures, backside power delivery networks, and high-density interconnect scaling.
Collaborate with semiconductor equipment suppliers and specialty chemical vendors to advance single-wafer and batch wet-processing capabilities.
Co-engineer custom dispense, megasonic, and chamber hardware solutions.
Use computational fluid dynamics, chemical kinetics modeling, statistical physics, and data science to accelerate formulation screening, reduce surface defects, and improve line yield.
Translate chemical, electrochemical, and surface-science findings into patents, trade secrets, and proprietary wet-processing solutions.
Scale laboratory prototypes and coupon-level studies to 300mm fab production and deploy processes across Intel fabs using the Copy Exactly methodology.