Lead, PCB Design - Signal Integrity - Stackup Specialist (Various Locations)

L3Harris•Palm Bay, FL

20h•Onsite

About The Position

L3Harris seeks a Signal Integrity/Stackup PCB Design Specialist to define and optimize rigid, rigid-flex, and multilayer PCB stackups for signal integrity, power integrity, impedance control, EMI/EMC, thermal performance, and fabrication constraints. The role works with electrical, RF, mechanical, layout, and manufacturing teams to translate CCA requirements into practical, production-ready stackup and board-layer strategies. It is a hands-on PCB design position with ownership of stackup definition, impedance planning, and stackup-related layout guidance, supporting designs that meet performance, reliability, quality, and cost objectives. The specialist develops stackups for high-speed, mixed-signal, RF, and power applications; establishes controlled-impedance structures, dielectric materials, copper weights, layer assignments, and via strategies; and provides layout guidance for routing rules, return paths, reference planes, grounding, shielding, and layer transitions. The role also evaluates electrical, thermal, mechanical, cost, EMI/EMC, and manufacturability tradeoffs; collaborates with PCB fabricators to validate materials, tolerances, impedance coupons, bend-region constraints, and production capabilities; reviews layouts and fabrication packages; and supports prototype and production issue resolution. The position maintains stackup drawings, impedance tables, fabrication notes, material specifications, and revision history. The position is located in Palm Bay, Florida; Carlsbad, California; or Herndon, Virginia. The schedule is 9/80: employees work 9 out of every 14 days, totaling 80 hours, with every other Friday off.

Requirements

Bachelor’s degree and a minimum of 9 years of prior relevant experience; or a graduate degree and a minimum of 7 years of prior related experience; or, in lieu of a degree, a minimum of 13 years of prior related experience.
Strong understanding of controlled impedance, transmission lines, return paths, dielectric properties, copper roughness, insertion loss, and crosstalk.
Knowledge of rigid and rigid-flex PCB fabrication processes, materials, bend-region constraints, and manufacturing requirements.
Ability to develop stackup requirements and communicate them to PCB layout teams and fabricators.
Experience developing rigid, rigid-flex, and multilayer PCB stackups for high-speed, RF, mixed-signal, or high-power products.

Nice To Haves

Proficiency with Siemens Xpedition PCB design or similar tools.
Experience using Siemens HyperLynx Z-planner for PCB stackup design.
Experience with DDR, PCIe, USB, Ethernet, SerDes, RF, or high-current power-delivery designs.
Cadence Allegro and Altium PCB experience.
Experience designing multilayer printed circuit boards for radio-frequency or mixed-signal applications.
Familiarity with Design for Manufacturability (DFM) and Design for Testability (DFT) principles.
Experience with three-dimensional mechanical integration and electromagnetic-compatibility considerations.
Familiarity with product lifecycle management (PLM) systems and engineering configuration-control processes.
IPC Certified Interconnect Designer (CID/CID+).

Responsibilities

Design and document rigid, rigid-flex, and multilayer PCB stackups for high-speed, mixed-signal, RF, and power applications.
Define controlled-impedance structures, dielectric materials, copper weights, layer assignments, and via strategies.
Partner with electrical engineers to translate SI/PI requirements into routing rules, return-path planning, reference-plane strategy, grounding, shielding, and layer-transition guidance.
Evaluate stackup tradeoffs across electrical performance, EMI/EMC, thermal needs, mechanical requirements, cost, and manufacturability.
Collaborate with PCB fabricators to validate materials, impedance coupons, fabrication tolerances, bend-region constraints, and production capability.
Review PCB layouts and fabrication packages for stackup-related risks and provide corrective guidance.
Maintain stackup drawings, impedance tables, fabrication notes, material specifications, and revision history.
Support prototype and production issue resolution involving impedance, crosstalk, loss, resonance, warpage, or EMI.
Develop stackup requirements for PCB layout, including layer usage, differential-pair routing, via transitions, reference planes, and high-speed design constraints.
Communicate stackup, impedance, and material requirements directly to PCB fabricators.