Lead, PCB Design - Signal Integrity - Stackup Specialist (Various Locations)

L3Harris Technologies•Palm Bay, FL

2d•$110,500 - $205,000

About The Position

L3Harris is hiring a Signal Integrity/Stackup PCB Design Specialist to define and optimize rigid, rigid-flex, and multilayer PCB stackups for signal integrity, power integrity, impedance control, EMI/EMC, thermal performance, and fabrication constraints. The role translates CCA requirements into practical, production-ready signal-integrity strategies and board-layer plans in collaboration with electrical, RF, mechanical, layout, and manufacturing teams. It is a hands-on PCB design position with particular ownership of stackup definition, impedance planning, and stackup-related layout guidance. The team works to ensure designs meet performance, reliability, quality, and cost objectives. The position is available in Palm Bay, Florida; Carlsbad, California; or Herndon, Virginia. The schedule is 9/80: employees work 9 out of every 14 days, totaling 80 hours, and have every other Friday off.

Requirements

Bachelor’s degree and at least 9 years of prior relevant experience; or a graduate degree and at least 7 years of prior related experience; or, in lieu of a degree, at least 13 years of prior related experience.
Strong understanding of controlled impedance, transmission lines, return paths, dielectric properties, copper roughness, insertion loss, and crosstalk.
Knowledge of rigid and rigid-flex PCB fabrication processes, materials, bend-region constraints, and manufacturers.
Experience developing rigid, rigid-flex, and multilayer PCB stackups for high-speed, RF, mixed-signal, or high-power products.

Nice To Haves

Proficiency with Siemens Xpedition PCB design or similar tools.
Experience using Siemens HyperLynx Z-planner for PCB stackup design.
Experience with DDR, PCIe, USB, Ethernet, SerDes, RF, or high-current power-delivery designs.
Cadence Allegro and Altium PCB experience.
Experience designing multilayer printed circuit boards for radio-frequency or mixed-signal applications.
Familiarity with Design for Manufacturability (DFM) and Design for Testability (DFT) principles.
Experience with three-dimensional mechanical integration and electromagnetic-compatibility considerations.
Familiarity with product lifecycle management (PLM) systems and engineering configuration-control processes.
IPC Certified Interconnect Designer (CID/CID+).

Responsibilities

Design and document rigid, rigid-flex, and multilayer PCB stackups for high-speed, mixed-signal, RF, and power applications.
Define controlled-impedance structures, dielectric materials, copper weights, layer assignments, and via strategies.
Work with electrical engineers to turn SI/PI requirements into routing rules, return-path plans, reference-plane strategies, grounding, shielding, and layer-transition guidance.
Evaluate stackup tradeoffs involving electrical performance, EMI/EMC, thermal needs, mechanical requirements, cost, and manufacturability.
Collaborate with PCB fabricators to validate materials, impedance coupons, fabrication tolerances, bend-region constraints, and production capability.
Review PCB layouts and fabrication packages for stackup-related risks and provide corrective guidance.
Maintain stackup drawings, impedance tables, fabrication notes, material specifications, and revision history.
Support prototype and production issue resolution involving impedance, crosstalk, loss, resonance, warpage, or EMI.
Develop stackup requirements for PCB layout, including layer usage, differential-pair routing, via transitions, reference planes, and high-speed design constraints.
Communicate stackup, impedance, and material requirements directly to PCB fabricators.