Head of Silicon Product Engineering

Normal Computing Corporation•Palo Alto, CA

About The Position

Normal Computing is an applied AI company developing foundational hardware and software for the semiconductor industry, AI infrastructure, and broader systems. The Head of Silicon Product Engineering will own the work between design completion and realization of a production product for Normal’s custom AI-inference silicon. This build role establishes the team, vendor relationships, and processes needed to take silicon from tape-out through high-volume manufacturing, while setting test and calibration methodology for a new silicon program.

Requirements

  • 15+ years in semiconductor product/test engineering, with direct ownership of silicon from NPI through high-volume manufacturing.
  • Proven experience selecting and managing OSAT and foundry partners, including cost, quality, and yield negotiations.
  • Deep hands-on background in packaging, ATE, and post-silicon bring-up and validation.
  • Experience with production test and screening methodology for complex, high-reliability products.
  • Track record of building and scaling engineering teams from an early stage.
  • Strong cross-functional fluency with design, architecture, and supply chain organizations.
  • Bachelor’s or Master’s degree in Electrical Engineering or a related field.

Nice To Haves

  • Experience bringing up test and qualification for a new or unconventional silicon architecture, rather than only a new generation of a familiar architecture.
  • Experience with memory-adjacent product engineering, such as DRAM, HBM, or custom memory modules.
  • Experience at an AI or high-performance computing startup where design, verification, and product engineering worked in tight iteration cycles.
  • Comfort operating in an environment where test methodology is being developed alongside the hardware.

Responsibilities

  • Own end-to-end post-silicon bring-up, characterization, validation, and debug across multiple silicon generations.
  • Define and drive packaging and test strategy, including ATE program development, test coverage, and test-condition optimization for yield, quality, and performance.
  • Select, qualify, and manage OSAT and test-house partners through NPI and high-volume manufacturing, including cost, quality, and yield negotiations.
  • Lead yield learning and qualification from early silicon through production ramp, including root-cause analysis of systematic and random failures.
  • Own production calibration and screening methodology for memory products to meet performance and reliability targets at volume.
  • Build and lead a high-performing silicon product engineering organization, including hiring, processes, and tooling.
  • Partner with design, architecture, and supply chain teams to ensure designs are producible, testable, and optimized for cost and yield.
  • Build data-analysis practices using characterization and manufacturing data from wafer acceptance testing, sort, package, and system-level test to identify failure mechanisms early.
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