WPM Integration: Defect Engineer

Intel•Rio Rancho, NM

1d•Onsite

About The Position

The Wafer Packaging Manufacturing (WPM) organization is a global team focused on optimizing advanced packaging high-volume manufacturing processes to maximize yield, quality, and customer satisfaction. Its portfolio includes EMIB and Foveros wafer processing, TSV reveal, C4 bumping, Die Prep, and Wafer Level Assembly. The WPM Advanced Packaging Defect Reduction Engineer protects yield and improves defect performance across advanced semiconductor packaging processes. The role partners with module engineering, QNR, manufacturing operations, and yield teams across a global network, combining high-volume manufacturing expertise with technical rigor to deliver lasting solutions. This position requires on-site presence and is based in Albuquerque, New Mexico, with an additional location in Hillsboro, Oregon. It is an experienced-hire role on Shift 1 and is not eligible for Intel immigration sponsorship.

Requirements

Bachelor's degree in engineering or a related field and at least 3 years of experience, or a master's degree in engineering or a related field and at least 2 years of experience, or a PhD in engineering or a related field with no prior professional experience.
Experience in a combination of data extraction, synthesis, and analysis using tools such as SQL and Python; technology transfer and new product introduction activities in semiconductor manufacturing; and failure analysis and data-mining techniques to identify trends and drive actionable improvements.
Proven ability to lead problem-solving initiatives and process improvement projects.
Exceptional communication skills for effective collaboration across multidisciplinary teams.
Passion for mentoring and fostering technical growth within teams.

Nice To Haves

Strong understanding of semiconductor process flow, equipment, and process characterization techniques.
Experience with design of experiments (DOE), statistical process control (SPC), and process capability analysis.

Responsibilities

Own assigned advanced packaging layers and establish POR defect inspection, classification, and review operations, including inspection recipes and NPI procedures.
Drive ADC implementation, maintain defect classification specifications, and maintain the Defect Menagerie for assigned layers.
Partner with metrology tool owners to establish and maintain SPC charts for each defect mode and layer, and create OCAPs for metrology teams and module engineering to respond to out-of-control events and defect tracers.
Own process health and product quality for the WPM manufacturing line, including defect performance, yield trends, excursions, and baseline process changes.
Manage defect excursions through resolution, including containment, wafer and lot risk assessment, disposition, root cause, downstream impact, quality events, and non-POR material.
Drive systematic defect reduction and process improvement using process and metrology data, SORT data, DOEs, FRECLs, ATVs, and experiments with process modules.
Co-lead cross-functional defect health reviews, including IMTs, Focus Teams, and Task Forces covering tracers, trends, out-of-control events, wafers at risk, excursions, and corrective actions.
Extract, analyze, and correlate data to improve defects, yields, and VF matching, identifying defect-driving toolsets through analysis, MBPS, and failure analysis.
Quantify chronic defect gaps to goal, document roadmaps to close gaps, and ensure defect health dashboards are operational and incorporated into factory business processes.
Communicate defect metrics and findings to module and factory stakeholders through weekly summaries and strategic quarterly reviews.
Provide defect training to technicians, peers, and module teams.
Lead problem-solving initiatives and process improvement projects, collaborate across multidisciplinary teams, and mentor others to foster technical growth.