Process Integration Development Engineer - Defect Metrology

Intel•Hillsboro, OR

22h•Hybrid

About The Position

Intel's Logic Technology Development (LTD) organization develops semiconductor manufacturing processes and supports their transition from research to high-volume manufacturing. The Defect Metrology team characterizes advanced silicon processes, identifies defects that affect yield and performance, and works with process module and integration teams to develop and qualify defect-reduction fixes. The role focuses on F25 processes and uses metrology tools, test vehicles, and Model-Based Problem Solving (MBPS) to meet yield and program milestone objectives. The engineer owns a process segment's defect-metrology strategy, data quality, and response to defect-trend shifts. The position also develops recipes and response plans for New Product Introduction (NPI), presents defect summaries, and collaborates with integration, yield, and failure-analysis teams to identify root causes and implement preventative actions. This role is hybrid and based in Hillsboro, Oregon.

Requirements

Master's degree with at least 3 years of experience, or Ph.D. with at least 1 year of experience, in Computer Science, Physics, Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Nuclear Engineering, Optics, or Chemistry with a focus on hands-on experimental research.
At least 1 year of experience in experimental research, including designing and conducting experiments, operating characterization, fabrication, or synthesis equipment, and analyzing statistical data.
At least 1 year of experience with materials characterization (such as SEM or TEM), materials fabrication, synthesis, metrology, or statistical/data analysis using tools such as MATLAB, Excel, or JMP.
At least 1 year of experience with semiconductor processing fundamentals, such as lithography, wet or dry etch, and chemical or mechanical polishing; semiconductor or transistor device physics; and design of experiments.
At least 1 year of experience with complex problem-solving methodologies such as root cause analysis, MBPS, 5 Why, or Fishbone.
Strong data-analysis and problem-solving skills.
Teamwork, flexibility, and adaptability to changing business needs.
A strong ownership mindset and ability to drive problems to closure.
Excellent communication and navigation skills with larger audiences.
Ability to understand and adhere to Intel cultural values, including Customer First, Fearless Innovation, Results Driven, One Intel, Integrity, Quality, and Inclusion.

Nice To Haves

At least 1 year of experience in defect metrology, defect improvement, yield improvement, or process integration.
Experience with Statistical Process Control (SPC) or Design of Experiments (DOE) principles.
Expertise in semiconductor physics or semiconductor processing.
Expertise with defect metrology tools such as brightfield, darkfield, or voltage contrast (VC).

Responsibilities

Own a process segment and ensure adequate metrology is in place to detect and respond to yield-limiting defects before end-of-line sort.
Manage data-collection strategies and the integrity and quality of data from metrology scans in the assigned segment.
Investigate and respond to exclusionary baseline shifts to restore segment defect health to a capable, demonstrated baseline.
Develop new recipes and response action plans as part of New Product Introduction (NPI).
Provide navigation and leadership to meet Intel yield objectives using state-of-the-art metrology tools and test vehicles, including QTM and Short Loop.
Organize and present defect summaries to F25, LTD, and MDCE engineering teams.
Partner with Intel Integration, Yield, and failure-analysis labs to identify the root cause of defect issues.
Hold team members and collaborators accountable for quality through Integrated Module Team (IMT) and Focus Team (FT) forums.
Work collaboratively within the LTD Defect Metrology group and build relationships with other LTD teams.
Model and establish a team culture of trust, collaboration, safety, accountability, and sustained excellence.
Develop and qualify process fixes with process module and integration teams using Model-Based Problem Solving (MBPS).
Respond to defect-trend shifts, isolate root causes, and implement preventative actions consistent with 8D methodology.