WPM Integration: Defect Engineer

Intel Corporation•Rio Rancho, NM

2d•$103,730 - $146,440•Onsite

About The Position

The Wafer Packaging Manufacturing (WPM) organization is a global team focused on advanced packaging technology and high-volume manufacturing. Its portfolio includes EMIB and Foveros wafer processing, TSV reveal, C4 bumping, Die Prep, and Wafer Level Assembly. The Advanced Packaging Defect Reduction Engineer protects yield and improves defect performance across advanced semiconductor packaging processes, partnering with module engineering, QNR, manufacturing operations, and yield teams across global sites.

Requirements

Bachelor's degree in engineering or a related field and at least 3 years of experience; or a master's degree in engineering or a related field and at least 2 years of experience; or a PhD in engineering or a related field with no prior professional experience.
Experience in data extraction, synthesis, and analysis using tools such as SQL and Python.
Experience with technology transfer and new product introduction (NPI) activities in semiconductor manufacturing.
Expertise in failure analysis and data mining techniques to identify trends and drive actionable improvements.
Strong communication skills for collaborating across multidisciplinary teams.
Position is not eligible for Intel immigration sponsorship.

Nice To Haves

Strong understanding of semiconductor process flow, equipment, and process characterization techniques.
Experience with design of experiments (DOE), statistical process control (SPC), and process capability analysis.

Responsibilities

Own assigned advanced packaging layers and establish POR defect inspection, classification, and review operations, including inspection recipes and NPI procedures.
Drive ADC implementation and maintain defect classification specifications and the Defect Menagerie for assigned layers.
Partner with metrology tool owners to establish and maintain SPC charts for each defect mode and layer, and create OCAPs for metrology teams and module engineering to address out-of-control events and defect tracers.
Own process health and product quality for the WPM manufacturing line, including defect performance, yield trends, excursions, and baseline process changes.
Lead defect excursions through resolution, including containment, wafer and lot risk assessment, disposition, root cause analysis, downstream impact, quality events, and non-POR material.
Drive systematic defect reduction and process improvement using process and metrology data, SORT data, DOEs, FRECLs, ATVs, and experiments with process modules.
Co-lead cross-functional defect health reviews, including IMTs, Focus Teams, and Task Forces covering tracers, trends, OOCs, wafers at risk, excursions, and corrective actions.
Extract, analyze, and correlate data to improve defects, yields, and VF matching, identifying defect-driving toolsets through analysis, MBPS, and FA.
Quantify chronic defect gaps against goals, document roadmaps to close gaps, and ensure defect health dashboards are operational and incorporated into factory business processes.
Communicate defect metrics and findings to module and factory stakeholders through weekly summaries and quarterly strategic reviews.
Provide defect training to technicians, peers, and module teams.
Lead problem-solving initiatives and process improvement projects, collaborate across multidisciplinary teams, and mentor others to foster technical growth.