Cisco Silicon One is seeking a Signal and Power Integrity Engineer to help develop next-generation ASIC packaging for deployment across Cisco platforms. The role defines, designs, and verifies ASIC packaging, with a focus on advanced IC package design and heterogeneous system integration using technologies such as 2.5D fanout substrates. The engineer develops and documents design rules for ultra-high-speed signaling and analyzes substrate signal and power integrity. The role includes collaborating with layout teams on interposer, substrate, and PCB solutions; designing and documenting ASIC packages for high-volume, high-quality release; and conducting post-layout extraction and reporting. The engineer also works with system partners, vendors, and design leads to achieve power and signal integrity goals and resolve complex technical issues. The role is based within commuting distance of Cisco’s San Jose, California office and requires commuting to the office at least 4–5 days per week.
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Job Type
Full-time
Career Level
Entry Level