SI/PI Tech Project Manager

Broadcom • Fort Collins, CO

3d • Onsite

About The Position

Broadcom is seeking an experienced SI/PI technical project manager to support engineers designing complex flip-chip-BGA packages, PCBs, and system channel links for high-performance ASICs with high-speed SerDes and high-power-delivery requirements. The role is part of a worldwide R&D team developing package designs for AI, networking, high-performance computing, and 5G base stations. Designs include 448G SerDes, optics, 5G RF/Microwave ADC/DAC, HBM, and DDR.

The position supports and develops technical work with engineering teams and contributes to technical methodologies, flows, and project management. It requires on-site work at a Broadcom office five days a week in Fort Collins or San Jose. This is not a remote-work position; the role involves direct collaboration, real-time engagement with lab equipment, and face-to-face team co-design.

Requirements

• BSEE or similar field and 12 or more years of work experience; or MSEE or similar field and 10 or more years; or PhD in EE or similar field and 7 or more years.
• Knowledge of package-level, PCB-level, and/or system-level signal integrity and power integrity applicable to package and PCB designs.
• Self-management, organization, and clear communication skills.
• Technical understanding related to system signal and power integrity development and support, including project management, automation code development, SI/PI EDA extractions and simulations, system-level SerDes channel results, lab measurements, passive and active measurements, lab and measurement correlation, lab equipment needs and management, package and PCB lifecycle and design flows, substrate and package integration into overall system implementation and associated trade-offs, and design data creation and use.

Nice To Haves

• Previous experience managing people and projects.

Responsibilities

• Navigate and track project plans for more than 20 concurrent package and PCB designs, including scope, schedules, and resources, from a technical execution standpoint.
• Understand team members' skill sets and traits to maximize productivity and retention.
• Organize team and customer activities to keep projects on track.
• Communicate plans, status, next steps, and risks clearly and concisely on a regular basis.
• Create technical methodologies for signal and power integrity solutions.
• Understand and support package and PCB technologies, incorporating input from team members.
• Collaborate with customers, vendors, and cross-functional teams.
• Cooperate with worldwide teams across multiple time zones, including co-design with internal team members and external vendor designers.

Benefits

• Discretionary annual bonus.
• Competitive new-hire equity grant and opportunity to receive annual equity awards.
• Medical, dental, and vision plans.
• 401(k) participation with company matching.
• Employee Stock Purchase Program (ESPP).
• Employee Assistance Program (EAP).
• Company-paid holidays.
• Paid sick leave and vacation time.
• Paid Family Leave and other leaves of absence in accordance with applicable laws.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior