SI/PI Tech Project Manager

Broadcom • San Jose, CA

1d • Onsite

About The Position

Broadcom is seeking an experienced SI/PI technical project manager to assist engineering teams designing complex flip-chip-BGA packages, PCBs, and system channel links for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. The role is part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence, networking, high-performance computing, and 5G base stations. Designs include 448G SerDes, optics, 5G RF/Microwave ADC/DAC, HBM, and DDR.

The position supports and develops work with engineering teams and contributes to technical methodologies, flows, and technical project management. It requires close collaboration with worldwide colleagues, vendors, customers, and cross-functional partners. The role is based on-site at the Broadcom office five days a week and requires real-time engagement with lab equipment and face-to-face team co-design; it is not remote.

Requirements

• BSEE or similar field and 12+ years of work experience, or MSEE or similar field and 10+ years, or PhD in EE or similar field and 7+ years.
• Knowledge of package-level, PCB-level, and/or system-level signal integrity and power integrity applicable to package and PCB designs.
• Ability to cooperate with a worldwide team across multiple time zones, including co-design with internal team members and external vendor designers.
• Self-management, organizational, and clear communication skills.
• Technical understanding related to system signal and power integrity development and support, including project management, automation code development, SI/PI EDA extractions and simulations, system-level SerDes channel results, lab measurements, lab and measurement correlation, lab equipment needs and management, package and PCB lifecycle and design flows, substrate and package trade-offs in system implementation, and design data such as package .mcm files, package spreadsheets, and POD, lid, and substrate drawings.
• Ability to work on-site at the Broadcom office five days a week.

Nice To Haves

• Previous experience managing people and projects.

Responsibilities

• Navigate and track project plans for 20+ concurrent package and PCB designs, including scope, schedules, and resources, from a technical execution standpoint.
• Understand team members’ skills and traits to maximize productivity and retention.
• Organize team and customer activities to keep projects on track.
• Clearly communicate plans, status, next steps, and risks on a regular basis.
• Create technical methodologies for signal and power integrity solutions.
• Understand and support package and PCB technologies, incorporating input from team members.
• Collaborate with customers, vendors, and cross-functional teams.
• Support technical development and project management across package/PCB design, SI/PI, and system implementation.

Benefits

• Discretionary annual bonus.
• Competitive new-hire equity grant and opportunity for annual equity awards, subject to applicable plan documents and award agreements.
• Medical, dental, and vision plans.
• 401(k) participation with company matching.
• Employee Stock Purchase Program (ESPP).
• Employee Assistance Program (EAP).
• Company-paid holidays.
• Paid sick leave and vacation time.
• Paid Family Leave and other leaves of absence in accordance with applicable laws.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior