Advanced Packaging Process Integration Engineer - Principal

Skywater•Kissimmee, FL

About The Position

The Principal Advanced Packaging Process Integration Engineer will lead the development, integration, and improvement of advanced packaging process flows for Skywater Florida’s foundry clients. The role works with customers to develop customized technologies, including silicon interposers, FanOut, and hybrid bonding, guiding products from proof of concept through qualification and transfer to volume manufacturing. The engineer translates customer package requests into manufacturable process flows, identifies development needs, and leads process teams to deliver qualified products on schedule and with high yield. The work spans clients and devices involving MEMS, photonics, high-performance computing, CMOS, memory, AI, quantum devices, and ASICs. It includes designing and conducting experiments, monitoring process and electrical test results, diagnosing defects and process issues, and coordinating with process, tool, CAD, and failure-analysis teams. The position also involves regular customer communication and process reviews to support transition to full-scale production. Other duties may be assigned. Duty-time percentages are estimates and may vary.

Requirements

Bachelor of Science in Engineering; a master’s degree or Ph.D. is preferred.
10+ years of Process Development and Integration Engineer experience in an advanced packaging fab or semiconductor fab environment related to FanOut wafer-level assembly and hybrid bonding.
Knowledge of or experience with advanced packaging fab processing tools.
Knowledge of MEMS, photonic, HPC, AI, ASIC, or quantum devices and integration, supported by a relevant combination of experience and/or an advanced degree.
Knowledge of DOE, SPC, and Six Sigma concepts and applications.
Clear problem-solving capability; data-driven, inventive, solution-oriented approach; and ability to articulate thought processes.
Exceptional oral and written communication skills.
Ability to thrive in a large cross-functional program environment.
Ability to work independently and in cross-functional teams to solve problems.
Strong organizational skills and work ethic.
U.S. citizenship; the position requires holding or having the ability to obtain a government security clearance.

Nice To Haves

Project management skills and/or defined project-management training.
Master’s degree or Ph.D.

Responsibilities

Translate client package requests into process flows using silicon interposer, FanOut, and hybrid bonding manufacturing processes.
Identify process-development needs and lead the process team in delivering qualified products on schedule and with high yield.
Lead task forces to identify root causes, correct problems, and maintain product deliverables when required.
Use knowledge of tool-set capabilities and interdependencies to create recipes involving temporary and permanent bonding, electrolytic and PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflow, flip-chip, and wire-bond tools.
Develop comprehensive wafer-manufacturing process flows and ensure their execution.
Collaborate with CAD engineers to validate incoming layout files and construct frames with metrology boxes and electrical test structures.
Integrate TSV-first and/or TSV-last process flows for foundry-client packages.
Use metrology tools to characterize process conditions, identify defect root causes, and document results.
Investigate and drive integration changes to improve device performance and yield.
Work with process and tool engineers to identify process marginalities and make improvements.
Coordinate with the failure-analysis lab to submit samples for cross-sectioning and support continuous improvement.
Monitor selected in-line and end-of-line SPC charts for trends or excursions that may be addressed through integration changes.
Create quick-turn learning cycles to identify issues early and establish final products and process flows for foundry clients.
Incorporate, monitor, and improve electrical test parameters to deliver electrically good final packages.
Design and conduct experiments to validate and optimize process recipes.
Monitor customer material and proactively address processing issues.
Hold regular customer meetings and provide project updates as materials move through production.
Conduct process reviews to support transition of devices to full-scale production.
Perform other duties as assigned.