Advanced Packaging Process Integration Engineer - Principal

SkyWater Technology Foundry, Inc.•Kissimmee, FL

3d•$136,960 - $205,440

About The Position

The Advanced Packaging Process Integration Engineer will lead development and improvement of integrated advanced packaging process flows for SkyWater Florida. The team works directly with customers to develop customized technologies, including silicon interposers, FanOut, and hybrid bonding. The role takes client concepts from proof of concept through product qualification and transfer to volume manufacturing, delivering qualified products to foundry clients. The engineer will translate customer package requests into manufacturable process flows, identify development needs, coordinate process teams, and lead troubleshooting when needed. The position integrates processes and equipment across temporary and permanent bonding, metal and dielectric deposition, photolithography, etch, CMP, thermal processing, flip chip, and wire bonding. Work spans customer programs involving MEMS, photonics, high-performance computing, CMOS, memory, AI, ASIC, and quantum devices. The role involves close collaboration with customers, CAD engineers, process and tool engineers, and the failure analysis laboratory. The engineer will develop and optimize recipes, conduct experiments, characterize processes, address defects and yield issues, monitor statistical process control and electrical test results, and guide products toward full-scale production. Regular customer meetings and process reviews are required. Other duties may be assigned.

Requirements

BS in Engineering.
10 or more years of Process Development and Integration Engineer experience in an advanced packaging fab or semiconductor fab environment related to FanOut wafer-level assembly and hybrid bonding.
Knowledge of or experience with advanced packaging fab processing tools.
Knowledge of MEMS, photonic, HPC, AI, ASIC, or quantum devices and integration, supported by a relevant combination of experience and/or an advanced degree.
Knowledge of DOE, SPC, and Six Sigma concepts and applications.
Clear problem-solving capability; data-driven, inventive, solution-oriented approach; and ability to articulate thought processes.
Exceptional oral and written communication skills.
Ability to thrive in a large cross-functional program environment.
Ability to work independently and in cross-functional teams to solve problems.
Strong organizational skills and work ethic.
U.S. citizenship; the position requires holding or being able to obtain a government security clearance, which requires U.S. citizenship.

Nice To Haves

MS or PhD.
Project management skills and/or defined project management training.

Responsibilities

Translate client package requests into process flows using silicon interposer, FanOut, and hybrid bonding manufacturing processes.
Identify process development needs and lead the process team to deliver a qualifiable final product on schedule and with high yield.
Lead task forces to determine root causes, implement corrections, and maintain product deliverables when required.
Develop process recipes using equipment and processes for temporary and permanent bonding, electrolytic and PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflow, flip chip, and wire bonding.
Integrate processes for clients working on MEMS, photonics, high-performance computing, CMOS, memory, AI, quantum, and related devices.
Develop comprehensive wafer manufacturing process flows and ensure their execution.
Collaborate with CAD engineers to validate incoming layout files and construct frames with metrology boxes and electrical test structures.
Integrate TSV-first and/or TSV-last process flows for foundry client packages.
Use metrology tools to characterize process conditions, investigate defects, identify root causes, and document results.
Drive integration changes to improve device performance and yield.
Work with process and tool engineers to identify process marginalities and implement improvements.
Coordinate with the failure analysis laboratory to submit samples for cross-sectioning and support continuous improvement.
Monitor selected in-line and end-of-line SPC charts for trends or excursions that may be addressed through integration changes.
Create quick-turn learning cycles to identify issues early and establish final products and process flows for foundry clients.
Incorporate, monitor, and improve electrical test parameters to deliver electrically good final packages.
Design and conduct experiments to validate and optimize process recipes.
Monitor customer material and proactively address processing issues to ensure smooth workflow.
Conduct regular customer meetings and provide project progress updates as materials move through production.
Deliver process reviews to support transition of devices to full-scale production.
Perform other duties as assigned.