Advanced Packaging Process Integration Engineer - Principal

Skywater•Kissimmee, FL

About The Position

Skywater Florida’s Advanced Packaging group partners with customers to develop customized technologies, including silicon interposers, FanOut, and hybrid bonding. The Principal Process Integration Engineer leads development of these technologies, using the semiconductor fab’s capabilities to move customer projects from concept or proof of concept through product qualification and transfer to volume manufacturing. The role leads development and improvement of integrated Advanced Packaging process flows and delivery of qualified products to foundry clients, while communicating effectively with customers, colleagues, and management. The engineer translates customer package requests into manufacturable process flows, identifies development needs, and leads process teams to deliver qualified products on schedule and with high yield. The role integrates processes and tools across bonding, metal and dielectric deposition, photolithography, etch, CMP, thermal processing, flip chip, and wire bonding. It supports customer applications across MEMS, photonics, high-performance computing, CMOS, memory, AI, ASIC, and quantum devices, including TSV-first and TSV-last flows. The position involves developing wafer manufacturing flows; collaborating with CAD engineers on layout validation and test structures; characterizing processes and investigating defects; improving device performance and yield; monitoring SPC and electrical test parameters; designing experiments; overseeing customer material through production; and holding customer project reviews. The engineer also coordinates with process, tool, and failure-analysis teams and leads root-cause investigations and corrective actions as needed. Other duties may be assigned.

Requirements

Bachelor of Science in Engineering.
10 or more years of Process Development and Integration Engineer experience in an advanced packaging fab or semiconductor fab environment related to FanOut wafer-level assembly and hybrid bonding.
Knowledge of or experience with advanced packaging fab processing tools.
Knowledge of MEMS, photonic, HPC, AI, ASIC, or quantum devices and integration, supported by a relevant combination of experience and/or advanced degree.
Knowledge of DOE, SPC, and Six Sigma concepts and applications.
Clear problem-solving ability; data-driven and inventive approach; and ability to articulate thought processes.
Exceptional oral and written communication skills.
Ability to thrive in a large cross-functional program environment.
Ability to work independently and in cross-functional teams to solve problems.
Strong organizational skills and work ethic.
U.S. citizenship, required because the position requires holding or being able to obtain a government security clearance.

Nice To Haves

Master’s or Ph.D. degree.
Project management skills and/or defined project management training.

Responsibilities

Translate customers’ package requests into process flows using silicon interposer, FanOut, and hybrid bonding manufacturing processes.
Identify process development needs and lead the process team to deliver a qualifiable product on schedule and with high yield.
Lead task forces to identify root causes, correct issues, and maintain product deliverables when required.
Develop and improve integrated process flows using relevant bonding, deposition, lithography, etch, CMP, thermal processing, flip-chip, and wire-bonding tools.
Integrate processes for customers working on MEMS, photonics, high-performance computing, CMOS, memory, AI, ASIC, and quantum devices.
Develop comprehensive wafer manufacturing flows and support their execution.
Collaborate with CAD engineers to validate incoming layout files and construct frames with metrology boxes and electrical test structures.
Integrate TSV-first and/or TSV-last process flows for foundry client packages.
Use metrology tools to characterize process conditions, investigate defects, determine root causes, and document results.
Investigate and drive integration changes to improve device performance and yield.
Work with process and tool engineers to identify process marginalities and implement improvements.
Coordinate with the failure-analysis lab to submit samples for cross-sectioning and support continuous improvement.
Monitor selected in-line and end-of-line SPC charts for trends or excursions that may be addressed through integration changes.
Create quick-turn learning cycles to identify issues early and establish final products and process flows for foundry clients.
Incorporate, monitor, and improve electrical test parameters to deliver electrically good final packages.
Design and conduct experiments to validate and optimize process recipes.
Monitor customer material and proactively address processing issues.
Meet regularly with customers and provide project updates as material moves through production.
Conduct process reviews to support transition of devices to full-scale production.
Perform other duties as assigned.