Advanced Packaging Process Integration Engineer - Principal
About The Position
SkyWater is seeking a Principal-level Process Integration Engineer for its Advanced Packaging group in Florida. The team works with customers to develop customized technologies, including silicon interposers, FanOut, and hybrid bonding. The role leads development of new technologies and uses the semiconductor fab’s capabilities to take customer concepts from proof of concept through product qualification and transfer to volume manufacturing. The engineer leads, develops, and improves integrated Advanced Packaging process flows that deliver qualified products to foundry clients, communicating effectively with customers, colleagues, and management. The engineer translates client package requests into manufacturable process flows, coordinates process development and integration activities, resolves process and product issues, and improves yield and device performance. The position supports clients working on MEMS, photonics, high-performance computing, CMOS, memory, AI, quantum, and related devices. It involves work across process and tool engineering, CAD, metrology, failure analysis, customers, and cross-functional programs, as well as monitoring customer materials and providing progress updates through production and process reviews.
Requirements
- BS in Engineering.
- At least 10 years of Process Development and Integration Engineer experience in an advanced packaging fab or semiconductor fab environment related to FanOut wafer-level assembly and hybrid bonding.
- Knowledge of or experience with advanced packaging fab processing tools.
- MEMS, photonic, HPC, AI, ASIC, or quantum device and integration knowledge, supported by a relevant combination of experience and/or advanced degree.
- Knowledge of DOE, SPC, and Six Sigma concepts and applications.
- Clear problem-solving capability; data-driven, inventive, solution-oriented approach; and ability to articulate thought processes.
- Exceptional oral and written communication skills.
- Ability to thrive in a large cross-functional program environment.
- Ability to work independently and in cross-functional teams to solve problems.
- Strong organizational skills and work ethic.
- U.S. citizenship; the position requires holding or being able to obtain a government security clearance, which requires U.S. citizenship.
Nice To Haves
- MS or PhD in Engineering.
- Project management skills and/or defined project management training.
Responsibilities
- Translate client package requests into process flows using silicon interposer, FanOut, and hybrid bonding manufacturing processes.
- Identify process development needs and lead the process team to deliver a qualifiable product on schedule and with high yield.
- Lead task forces to determine root causes, correct issues, and maintain product deliverables when required.
- Use knowledge of process tool capabilities and interdependencies to create recipes involving temporary and permanent bonding, electrolytic and PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflow, flip-chip, and wire-bond tools.
- Integrate processes for clients working on MEMS, photonics, high-performance computing, CMOS, memory, AI, quantum, and other devices.
- Develop comprehensive wafer manufacturing process flows and ensure their execution.
- Collaborate with CAD engineers to validate incoming layout files and construct frames with metrology boxes and electrical test structures.
- Integrate TSV-first and/or TSV-last process flows for foundry client packages.
- Use metrology tools to characterize process conditions, identify defect root causes, and document results.
- Investigate and drive integration changes to improve device performance and yield.
- Work with process and tool engineers to identify process marginalities and implement improvements.
- Coordinate with the failure analysis lab to submit samples for cross-sectioning and support continuous improvement.
- Monitor selected in-line and end-of-line SPC charts for trends or excursions addressable through integration changes.
- Create quick-turn learning cycles to identify issues early and develop final products and process flows for foundry clients.
- Incorporate, monitor, and improve electrical test parameters to deliver electrically good final packages.
- Design and conduct experiments to validate and optimize process recipes.
- Monitor customer material and proactively address processing issues to maintain workflow.
- Conduct regular customer meetings and provide project progress updates as materials move through production.
- Deliver process reviews to support transition of devices to full-scale production.
- Perform other duties as assigned.
Benefits
- Competitive salary and opportunity to participate in incentive plans.
- 401(k) match.
- Life insurance.
- Benefits eligibility beginning on day one.
- Medical insurance.
- Dental insurance.
- Mental health benefits.
- Vision insurance.
- Legal planning benefits.
- Short- and long-term disability coverage.
- Paid time off.
- Paid holidays.
- On-site fitness facility.
- On-site self-serve market.
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What This Job Offers
Job Type
Full-time
Career Level
Principal
