Advanced Packaging Process Integration Engineer - Sr. Staff

Skywater•Kissimmee, FL

About The Position

The Advanced Packaging Process Integration Engineer will lead the development, integration, and improvement of customized advanced-packaging process flows for Skywater Florida’s foundry clients. The work supports technologies including silicon interposers, FanOut, and hybrid bonding, taking customer concepts from proof of concept through product qualification and transfer to volume manufacturing. The engineer will translate client package requirements into process flows, identify development needs, and coordinate process teams to deliver qualifiable products on schedule and with high yield. The role involves process integration for clients working on MEMS, photonics, high-performance computing, CMOS, memory, AI, and quantum devices. It requires collaborating with customers, CAD engineers, process and tool engineers, and failure-analysis teams; monitoring customer material and production progress; and conducting customer updates and process reviews. The position also requires strong written and oral communication and the ability to work independently and in cross-functional programs. Other duties may be assigned.

Requirements

Bachelor of Science in Engineering; a master’s degree or Ph.D. is preferred.
At least 7 years of Process Development and Integration Engineer experience in an advanced-packaging fab or semiconductor fab environment related to FanOut wafer-level assembly and hybrid bonding.
Knowledge of or experience with advanced-packaging fab processing tools.
Knowledge of MEMS, photonic, HPC, AI, ASIC, or quantum devices and integration, supported by a relevant combination of experience and/or an advanced degree.
Knowledge of DOE, SPC, and Six Sigma concepts and applications.
Clear problem-solving capability; a data-driven approach; inventive, solution-oriented thinking; and the ability to articulate thought processes.
Exceptional oral and written communication skills.
Ability to thrive in a large cross-functional program environment.
Ability to work independently and in cross-functional teams to solve problems.
Strong organizational skills and work ethic.
U.S. citizenship, because the position requires holding or being able to obtain a government security clearance.

Nice To Haves

Project management skills and/or formal project-management training.
Master’s degree or Ph.D.

Responsibilities

Translate client package requests into process flows using silicon interposer, FanOut, and hybrid-bonding manufacturing processes.
Identify process development needs and lead the process team to deliver qualified products on schedule and with high yield.
Lead task forces, when needed, to identify root causes, correct issues, and maintain product deliverables.
Develop and improve integrated process flows using relevant tool capabilities and interdependencies, including temporary and permanent bonding, electrolytic and PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflow, flip-chip, and wire-bond tools.
Integrate processes for clients developing MEMS, photonics, high-performance computing, CMOS, memory, AI, and quantum devices.
Develop comprehensive wafer-manufacturing process flows and ensure their execution.
Collaborate with CAD engineers to validate incoming layout files and construct frames with metrology boxes and electrical test structures.
Integrate TSV-first and/or TSV-last process flows for foundry client packages.
Use metrology tools to characterize process conditions, identify defect root causes, and document results.
Investigate and drive integration changes to improve device performance and yield.
Work with process and tool engineers to identify processing marginalities and implement improvements.
Coordinate with the failure-analysis lab to submit samples for cross-sectioning and support continuous improvement.
Monitor selected in-line and end-of-line SPC charts for trends or excursions that may be addressed through integration changes.
Create quick-turn learning cycles to identify issues early and establish final products and process flows for foundry clients.
Incorporate, monitor, and improve electrical test parameters to deliver electrically good final packages.
Design and conduct experiments to validate and optimize process recipes.
Monitor customer material and proactively address processing issues.
Hold regular customer meetings to provide updates as materials move through production.
Conduct process reviews to support transition of devices to full-scale production.
Perform other duties as assigned.