Advanced Packaging Process Integration Engineer - Sr. Staff

SkyWater Technology Foundry, Inc.•Kissimmee, FL

3d•$114,320 - $171,480

About The Position

The Senior Staff Advanced Packaging Process Integration Engineer will lead the development and improvement of integrated advanced-packaging process flows for SkyWater Florida and its foundry clients. The team works with customers on customized technologies, including silicon interposers, FanOut, and hybrid bonding, guiding products from initial concept or proof of concept through qualification and transfer to volume manufacturing. The role translates customer package requirements into manufacturable process flows, identifies development needs, and leads teams to deliver qualified products on schedule and with high yield. It also requires strong communication with customers, colleagues, and management. The engineer integrates processes and equipment across wafer manufacturing, including temporary and permanent bonding, metal and dielectric deposition, photolithography, etch, CMP, baking and reflow, flip chip, and wire bonding. The work supports customers and devices across MEMS, photonics, high-performance computing, CMOS, memory, AI, quantum, and related areas. The position involves developing and validating process flows and recipes, analyzing metrology and electrical test data, addressing defects and process excursions, improving performance and yield, monitoring customer material, and coordinating with customers and cross-functional teams through production and process reviews. Other duties may be assigned. This position requires a BS in Engineering and at least seven years of relevant process development and integration experience in an advanced-packaging or semiconductor fab environment related to FanOut wafer-level assembly and hybrid bonding. An MS or PhD is preferred. U.S. citizenship is required because the position requires holding or being able to obtain a government security clearance. The stated annual salary range is $114,320–$171,480; offered pay depends on factors including job-related experience, skills, education, and credentials.

Requirements

Bachelor of Science in Engineering.
At least 7 years of Process Development and Integration Engineer experience in an advanced-packaging fab or semiconductor-fab environment related to FanOut wafer-level assembly and hybrid bonding.
Knowledge of or experience with advanced-packaging fab processing tools.
Knowledge of MEMS, photonic, HPC, AI, ASIC, or quantum devices and integration, supported by a relevant combination of experience and/or advanced degree.
Knowledge of DOE, SPC, and Six Sigma concepts and applications.
Clear problem-solving ability; data-driven, inventive, solution-oriented approach; and ability to articulate thought processes.
Exceptional oral and written communication skills.
Ability to thrive in a large, cross-functional program environment.
Ability to work independently and in cross-functional teams to solve problems.
Strong organizational skills and work ethic.
U.S. citizenship; the position requires holding or being able to obtain a government security clearance.

Nice To Haves

Master's or PhD degree.
Project management skills and/or formal project management training.

Responsibilities

Translate client package requests into process flows using silicon interposer, FanOut, and hybrid-bonding manufacturing processes.
Identify process-development needs and lead the process team to deliver a qualifiable final product on schedule and with high yield.
Lead task forces, when needed, to identify root causes, correct issues, and maintain product deliverables.
Use knowledge of process-tool capabilities and interdependencies to create recipes involving bonding, metal and dielectric deposition, photolithography, etch, CMP, bake, reflow, flip chip, and wire bonding.
Integrate processes for clients and devices including MEMS, photonics, high-performance computing, CMOS, memory, AI, and quantum devices.
Develop comprehensive wafer-manufacturing process flows and ensure their execution.
Collaborate with CAD engineers to validate incoming layout files and construct frames with metrology boxes and electrical test structures.
Integrate TSV-first and/or TSV-last process flows for foundry-client packages.
Use metrology tools to characterize process conditions, investigate defect root causes, and document results.
Investigate and drive integration changes to improve device performance and yield.
Work with process and tool engineers to identify process marginalities and make improvements.
Coordinate with the failure-analysis lab to submit samples for cross-sectioning and support continuous improvement.
Monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed through integration changes.
Create quick-turn learning cycles to identify issues early and establish final products and process flows for foundry clients.
Incorporate, monitor, and improve electrical test parameters to deliver electrically good final packages.
Design and conduct experiments to validate and optimize process recipes.
Monitor customer material and proactively address processing issues to support smooth workflow.
Hold regular customer meetings and provide project updates as material moves through production.
Deliver process reviews to support transition of devices to full-scale production.
Perform other duties as assigned.