Advanced Packaging Process Integration Engineer - Sr. Staff

Skywater•Kissimmee, FL

About The Position

The Senior Staff Advanced Packaging Process Integration Engineer will lead the development and improvement of integrated advanced packaging process flows for Skywater Florida’s foundry clients. The Advanced Packaging group works with customers to develop customized technologies, including silicon interposers, FanOut, and hybrid bonding, supporting projects from proof of concept through product qualification and transfer to volume manufacturing. The engineer will translate customer package requests into manufacturable process flows, identify development needs, and lead process teams to deliver qualified products on schedule and with high yield. The role integrates processes and tools such as temporary and permanent bonding, electrolytic and PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflow, flip chip, and wire bonding. Work spans clients and devices including MEMS, photonics, high-performance computing, CMOS, memory, AI, ASIC, and quantum technologies. The position requires communication with customers, colleagues, and management, as well as collaboration across process, tool, CAD, and failure-analysis teams. It also involves monitoring customer material, running learning cycles and experiments, reviewing process and electrical test data, and supporting transition of devices to full-scale production. Other duties may be assigned.

Requirements

Bachelor of Science in Engineering.
At least 7 years of Process Development and Integration Engineer experience in an advanced packaging fab or semiconductor fab environment related to FanOut wafer-level assembly and hybrid bonding.
Knowledge of or experience with advanced packaging fab processing tools.
Knowledge of MEMS, photonic, HPC, AI, ASIC, or quantum devices and integration, supported by a relevant combination of experience and/or advanced degree.
Knowledge of DOE, SPC, and Six Sigma concepts and applications.
Clear problem-solving capability; data-driven, inventive, solution-oriented approach; and ability to articulate thought processes.
Exceptional oral and written communication skills.
Ability to thrive in a large cross-functional program environment.
Ability to work independently and in cross-functional teams to solve problems.
Strong organizational skills and work ethic.
U.S. citizenship; the position requires holding or being able to obtain a government security clearance.

Nice To Haves

Master’s or Ph.D. degree.
Project management skills and/or defined project management training.

Responsibilities

Translate client package requests into process flows using silicon interposer, FanOut, and hybrid bonding manufacturing processes.
Identify process development needs and lead the process team to deliver a qualifiable product on schedule and with high yield.
Lead task forces, when required, to identify root causes, correct issues, and maintain product deliverables.
Use knowledge of tool-set capabilities and process interdependencies to create recipes for advanced packaging processes.
Develop comprehensive wafer manufacturing process flows and ensure their execution.
Collaborate with CAD engineers to validate incoming layout files and construct frames with metrology boxes and electrical test structures.
Integrate TSV-first and/or TSV-last process flows for foundry client packages.
Use metrology tools to characterize process conditions, investigate defects, identify root causes, and document results.
Drive integration changes to improve device performance and yield.
Work with process and tool engineers to identify processing marginalities and implement improvements.
Coordinate with the failure-analysis lab to submit samples for cross-sectioning and support continuous improvement.
Monitor selected in-line and end-of-line SPC charts for trends or excursions that may be addressed through integration changes.
Create quick-turn learning cycles to identify issues early and establish final products and process flows for foundry clients.
Incorporate, monitor, and improve electrical test parameters to deliver electrically good final packages.
Design and conduct experiments to validate and optimize process recipes.
Monitor customer material and proactively address processing issues to maintain workflow.
Hold regular customer meetings and provide updates as materials move through production.
Deliver process reviews to support transition of devices to full-scale production.
Perform other duties as assigned.