Advanced Packaging Process Integration Engineer - Sr. Staff

SkyWater Technology Foundry, Inc.•Kissimmee, FL

3d•$114,320 - $171,480•Onsite

About The Position

The Advanced Packaging Process Integration Engineer will lead development of new, customized advanced packaging technologies for SkyWater Florida customers, including silicon interposers, FanOut, and hybrid bonding. The role translates customer package requests into integrated manufacturing process flows and leads development activities to deliver qualified products on schedule and with high yield, from proof of concept through product qualification and transfer to volume manufacturing. The engineer works with a broad range of customer devices and markets, including MEMS, photonics, high-performance computing, CMOS, memory, AI, ASIC, and quantum devices. The position requires close collaboration with customers, CAD engineers, process and tool engineers, failure analysis teams, and other cross-functional partners. The engineer will develop and optimize process recipes and flows, characterize process conditions, investigate defects and yield issues, monitor process control data, and communicate project status and process reviews. The role also includes other duties as assigned.

Requirements

Bachelor of Science in Engineering.
At least 7 years of Process Development and Integration Engineer experience in an advanced packaging fab or semiconductor fab environment related to FanOut wafer-level assembly and hybrid bonding.
Knowledge of or experience with advanced packaging fab processing tools.
Knowledge of MEMS, photonic, HPC, AI, ASIC, or quantum devices and integration, supported by a relevant combination of experience and/or advanced degree.
Knowledge of DOE, SPC, and Six Sigma concepts and applications.
Clear problem-solving ability; data-driven, inventive, solution-oriented approach; and ability to articulate thought processes.
Exceptional oral and written communication skills.
Ability to thrive in a large cross-functional program environment.
Ability to work independently and in cross-functional teams to solve problems.
Strong organizational skills and work ethic.
U.S. citizenship; the position requires holding or being able to obtain a government security clearance.

Nice To Haves

Master’s or Ph.D. degree.
Project management skills and/or formal project management training.

Responsibilities

Translate clients’ package requests into process flows using silicon interposer, FanOut, and hybrid bonding manufacturing processes.
Identify process development needs and lead process teams to deliver qualified products on schedule and with high yield.
Lead task forces to identify root causes, correct issues, and maintain product deliverables when needed.
Develop process recipes using tool capabilities for temporary and permanent bonding, electrolytic and PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflow, flip chip, and wire bonding.
Develop comprehensive wafer manufacturing process flows and ensure their execution.
Collaborate with CAD engineers to validate incoming layout files and construct frames with metrology boxes and electrical test structures.
Integrate TSV-first and/or TSV-last process flows for foundry client packages.
Use metrology tools to characterize process conditions, identify defect root causes, and document results.
Investigate and implement integration changes to improve device performance and yield.
Work with process and tool engineers to identify processing marginalities and implement improvements.
Coordinate with the failure analysis lab to submit samples for cross-sectioning and continuous improvement.
Monitor selected in-line and end-of-line SPC charts for trends or excursions that may be addressed through integration changes.
Create quick-turn learning cycles to identify issues early and establish final products and process flows for foundry clients.
Incorporate, monitor, and improve electrical test parameters to deliver electrically good final packages.
Design and conduct experiments to validate and optimize process recipes.
Monitor customer material and proactively address processing issues.
Conduct regular customer meetings and provide updates as materials move through production.
Deliver process reviews with the goal of transitioning devices to full-scale production.
Perform other duties as assigned.