NM Wafer Packaging Manufacturing: Advanced Packaging Module Engineer

Intel Corporation•Rio Rancho, NM

3d•$76,390 - $146,440•Onsite

About The Position

New Mexico Wafer Packaging Manufacturing (NMWPM) is seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. The roles support high-volume manufacturing and technology development, including process transfers and product start-ups for Foveros, Embedded Bridge, and Intel Foundry Services (IFS) technologies. Regular onsite presence is required to perform essential responsibilities. The successful candidate will drive operational excellence and safety, transfer and improve manufacturing processes, develop technology roadmaps, and install, qualify, and ramp equipment and processes for new product introductions. The role also addresses complex technical challenges, supports development and pilot production lines, evaluates equipment and software upgrades, and leads cross-functional initiatives.

Requirements

Bachelor's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related technical field.
Completed academic coursework, laboratory work, or technical projects in semiconductor technologies, electronics, or mechanical engineering.

Nice To Haves

At least 2 years of relevant experience with a Bachelor's degree, or no prior experience required with a Master's degree.
Familiarity with semiconductor manufacturing process flows, especially advanced packaging technologies.
Hands-on experience with semiconductor manufacturing equipment, including tool matching, calibration, and performance optimization.
Demonstrated success in tool installation, qualification, and production readiness activities.
Working knowledge of Design of Experiments (DOE) and its application to tool matching, process qualification, and continuous improvement.
Proficiency in data-driven problem solving and root cause analysis using methods such as Model-Based Problem Solving (MBPS), DOE, Statistical Process Control (SPC), and Failure Mode and Effects Analysis (FMEA).
Strong commitment to safety and promoting a safe work environment.
Ability to thrive in a dynamic environment with evolving priorities and technical challenges.
Results-oriented mindset, strong organizational skills, initiative, resourcefulness, and accountability.
Excellent analytical and problem-solving skills, urgency, and commitment to business objectives.
Ability to communicate complex technical concepts clearly and actionably to stakeholders at all organizational levels.
Demonstrated leadership, collaboration, prioritization, and problem-solving within high-performing teams.
Continuous improvement mindset and experience applying Lean principles and methodologies.

Responsibilities

Identify and implement safety and ergonomic improvements, excursion prevention measures, and initiatives to improve equipment availability, utilization, and cost efficiency.
Collaborate with partner factories to transfer processes, maintain Copy Exactly standards, share best practices, and improve processes and equipment performance.
Develop and execute technology roadmaps to meet process requirements, business objectives, and milestones.
Install, qualify, and ramp equipment and manufacturing processes for new product introductions and production start-ups.
Resolve complex technical challenges and implement systems to prevent recurrence.
Support and sustain development and pilot production lines during early test vehicle and production phases.
Partner with engineers, technicians, integration teams, shift leadership, and management to deliver development and manufacturing commitments.
Evaluate, qualify, and implement new hardware, software, and equipment upgrades.
Lead critical task forces and cross-functional initiatives related to areas of ownership and adjacent manufacturing processes.