About The Position

New Mexico Wafer Packaging Manufacturing (NMWPM) is expanding and hiring Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. The roles support high-volume manufacturing and technology development, including process transfers and product start-ups for Foveros, Embedded Bridge, and Intel Foundry Services technologies. The position requires regular onsite presence to perform essential responsibilities. The engineer will support technology roadmaps, install and qualify equipment and processes, resolve complex technical challenges, and sustain development and pilot production lines. The role involves working closely with partner factories and cross-functional manufacturing teams to meet technology, business, and production objectives.

Requirements

  • Bachelor's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related technical field.
  • Completed academic coursework, laboratory work, or technical projects in semiconductor technologies, electronics, or mechanical engineering.

Nice To Haves

  • At least 2 years of relevant experience with a bachelor's degree; no prior experience is required with a master's degree.
  • Familiarity with semiconductor manufacturing process flows, particularly advanced packaging technologies.
  • Hands-on experience with semiconductor manufacturing equipment, including tool matching, calibration, and performance optimization.
  • Demonstrated success in tool installation, qualification, and production readiness activities.
  • Working knowledge of Design of Experiments (DOE) methodologies and their application to tool matching, process qualification, and continuous improvement.
  • Proficiency in data-driven problem solving and root cause analysis using methodologies such as Model-Based Problem Solving (MBPS), DOE, Statistical Process Control (SPC), and Failure Mode and Effects Analysis (FMEA).
  • Commitment to safety and promoting a safe work environment.
  • Ability to thrive amid evolving priorities and technical challenges.
  • Results-oriented approach, strong organizational skills, initiative, resourcefulness, and accountability.
  • Strong analytical and problem-solving skills, urgency, and commitment to business objectives.
  • Ability to communicate complex technical concepts clearly and actionably to stakeholders at all organizational levels.
  • Success working in high-performing teams, with leadership, collaboration, prioritization, and problem-solving capabilities.
  • Continuous improvement mindset and experience applying Lean principles and methodologies.

Responsibilities

  • Identify and implement safety and ergonomic improvements, excursion prevention measures, and initiatives that improve equipment availability, utilization, and cost efficiency.
  • Collaborate with partner factories to transfer new processes, maintain Copy Exactly standards, share best practices, and improve process and equipment performance.
  • Develop and execute technology roadmaps to meet process requirements, business objectives, and key milestones.
  • Install, qualify, and ramp equipment and manufacturing processes for new product introductions and production start-up milestones.
  • Lead resolution of complex technical challenges and implement systems to prevent recurrence.
  • Support and sustain development and pilot production lines during early test vehicle and production phases.
  • Partner with engineers, technicians, integration teams, shift leadership, and management to deliver development and manufacturing commitments.
  • Evaluate, qualify, and implement hardware, software, and equipment upgrades.
  • Lead critical task forces and cross-functional initiatives in areas of ownership and adjacent manufacturing processes.

Benefits

  • Competitive pay
  • Stock bonuses
  • Health benefits
  • Retirement benefits
  • Vacation
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