NM Wafer Packaging Manufacturing Advanced Packaging Engineer

Intel Corporation•Rio Rancho, NM

3d•$103,730 - $198,820•Onsite

About The Position

New Mexico Wafer Packaging Manufacturing (NMWPM) is expanding and seeks engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. The role supports high-volume manufacturing and technology development, including process transfers and product start-ups for Foveros, Embedded Bridge, and Intel Foundry Services technologies. Regular onsite presence is required to perform essential job responsibilities. The engineer will help sustain and develop manufacturing processes and equipment, support pilot and production lines, and contribute to new product introductions and production start-ups. The position works closely with partner factories and cross-functional teams to deliver development and manufacturing commitments, improve operational performance, and resolve technical challenges.

Requirements

Bachelor's degree in a STEM or related engineering discipline and 4 or more years of relevant semiconductor industry experience; or a master's degree in a STEM or related engineering discipline and 3 or more years of relevant semiconductor industry experience; or a PhD in a STEM or related engineering discipline with relevant academic or research experience.
Relevant experience may include semiconductor processing and manufacturing, process characterization and optimization, manufacturing process control methodologies, continuous process improvement, equipment maintenance and troubleshooting, and Design of Experiments (DOE) and data-driven problem solving.
For candidates qualifying through the PhD pathway, relevant academic research, laboratory work, publications, or dissertation projects may be considered in lieu of additional full-time industry experience.
Commitment to safety and promoting a safe work environment.
Ability to thrive in a dynamic environment with evolving priorities and technical challenges.
Strong organization, initiative, resourcefulness, accountability, analytical and problem-solving skills, and a results-oriented mindset.
Ability to communicate complex technical concepts clearly and effectively to stakeholders at all organizational levels.
Ability to collaborate, lead, prioritize, and solve problems as part of high-performing teams.
Continuous improvement mindset and experience applying Lean principles and methodologies.

Nice To Haves

Hands-on semiconductor manufacturing experience focused on process sustaining and/or process development.
Knowledge of statistical analysis and experimental design, including application to tool matching, tool qualification, and process optimization.
Understanding of semiconductor process flows for logic and memory and related metrology techniques and assessments.
Project management experience, including leading cross-functional teams or task forces to solve complex technical challenges.
Strong communication and collaboration skills and ability to work effectively across diverse teams, functions, and geographic regions.

Responsibilities

Identify and implement safety and ergonomic improvements, excursion prevention measures, and initiatives to improve equipment availability, utilization, and cost efficiency.
Collaborate with partner factories to transfer processes, maintain Copy Exactly standards, share best practices, and improve process and equipment performance.
Develop and execute technology roadmaps to meet process requirements, business objectives, and milestones.
Install, qualify, and ramp equipment and manufacturing processes for new product introductions and production start-up milestones.
Resolve complex technical challenges and implement systems to prevent recurrence.
Support and sustain development and pilot production lines during early test vehicle and production phases.
Partner with engineers, technicians, integration teams, shift leadership, and management to deliver development and manufacturing commitments.
Evaluate, qualify, and implement new hardware, software, and equipment upgrades.
Lead task forces and cross-functional initiatives in areas of ownership and adjacent manufacturing processes.