The Module Engineering Manager leads a team of engineers supporting high-volume manufacturing processes and advances Intel’s next-generation packaging technologies. The role oversees daily operations, continuous improvement initiatives, and engineering strategies to enhance safety, quality, and productivity. The manager also develops hands-on technical expertise in the modules they own to guide deep technical improvement projects and foster a collaborative, inclusive work environment. The position is within Intel Corporation’s Wafer Packaging Manufacturing organization, which develops and sustains advanced manufacturing processes for high-volume production and supports packaging and semiconductor technologies across Intel’s global manufacturing network. The role is based onsite in Albuquerque, New Mexico, and focuses on the qualification and production ramp of next-generation Die Pick toolsets.
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Job Type
Full-time
Career Level
Manager