New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader

Intel•Rio Rancho, NM

1d•Onsite

About The Position

As a Module Engineering Manager, you will lead a team of engineers supporting high-volume manufacturing processes and advancing Intel's next-generation packaging technologies. You will oversee daily operations, facilitate continuous improvement, and execute engineering strategies to enhance safety, quality, and productivity. The role includes developing hands-on technical expertise in the modules you own to lead deep technical improvement projects. Intel's Wafer Packaging Manufacturing organization develops and sustains advanced manufacturing processes for high-volume production. It supports Intel's packaging and semiconductor technologies and contributes to operational excellence, quality improvements, and cost efficiencies across its global manufacturing network. The manager will facilitate technology transfer and matched processing across global sites, oversee Early Tool Set installation, qualification, and production ramp during factory transitions, and develop an internal technical team to qualify and ramp next-generation Die Pick toolsets. The role also involves mentoring engineers and developing long-term strategies to strengthen engineering capabilities and meet changing manufacturing requirements.

Requirements

Bachelor's degree in engineering, materials science, physics, or a related technical field.
At least 6 years of relevant experience.
At least 2 years of experience leading an engineering or manufacturing team, including leading teams, managing performance, and driving results aligned with organizational goals.
Experience in process characterization, troubleshooting, and process improvement in a high-volume manufacturing environment.
Experience with manufacturing practices and lean manufacturing principles.

Nice To Haves

At least 4 years of experience with a master's degree, or at least 2 years of experience with a Ph.D.
Extensive experience leading engineering teams with a focus on operational excellence and innovation.
Advanced knowledge of semiconductor processing or packaging technologies.
Demonstrated ability to collaborate with vendors and drive cross-functional results.
Exceptional communication and leadership skills, with a record of inspiring and empowering diverse teams.
Experience developing and implementing strategic plans to enhance engineering capabilities and future manufacturing efficiency.

Responsibilities

Lead and manage engineers supporting safe, high-volume manufacturing while improving quality, output, cost, and yield.
Set tactical direction and prioritize sustaining operations, systematic troubleshooting, and process optimization.
Collaborate with engineering and manufacturing teams to address integrated process and equipment challenges.
Develop and mentor engineers, building technical expertise, leadership skills, and long-term growth opportunities.
Build hands-on technical expertise in owned modules and lead deep technical improvement projects.
Facilitate technology transfer and matched processing across global sites through training sessions and audits.
Oversee Early Tool Set installation, qualification, and production ramp during factory transitions.
Mentor and develop an internal technical team to qualify and ramp next-generation Die Pick toolsets.
Develop and execute long-term strategies to enhance engineering capabilities and meet evolving manufacturing requirements.
Drive results through decision-making, goal setting, differentiated performance management, and accountability.
Promote innovation, inclusion, and disciplined execution to achieve operational excellence.