Systems Intern - Validation, Software, Design, Architecture & Packaging (USA)

Tenstorrent University•Austin, TX

9d•Onsite

About The Position

Tenstorrent is hiring a Systems Intern for teams spanning systems and silicon validation, system software, system design and architecture, and semiconductor packaging and mechanical design. The role is based on-site in Austin, Texas, or Santa Clara, California. Applicants submit one application and complete one recruiter screen before being matched with a specific team and location. Depending on team placement, the intern may help test physical chips and integrated systems, develop firmware and other hardware-facing software, define and evaluate system-level designs and interfaces, or work on semiconductor package and mechanical design. The work connects silicon, software, boards, packaging, power, thermal performance, and I/O. The internship offers hands-on experience with industry-standard lab equipment, low-level software development, and mechanical and thermal engineering for electronics, as well as cross-functional collaboration with architecture, mechanical design, package engineering, and software teams. The role is intended for students pursuing a relevant undergraduate or graduate degree. Internship terms are available in winter, summer, and fall, with recruiting cycles that vary by term. Compensation ranges from $50 to $70 per hour, including base and variable compensation targets; the actual offer depends on experience, skills, education, background, and location. Employment is contingent on eligibility to access U.S. export-controlled technology.

Requirements

Currently pursuing a BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or Mechanical Engineering.
Coursework or projects in embedded systems, microwave and signal integrity, board-level design, or thermal/mechanical engineering.
Experience using low-level programming languages such as C/C++ or Python, or hardware design and simulation tools such as CAD, FEA, or Verilog.
Problem-solving ability and foundational knowledge in at least one of electrical engineering, digital logic, computer architecture, or thermal/mechanical engineering.
Curiosity and passion for the intersection of software, silicon architecture, and the physical constraints of chip packaging and PCBs.
Eligibility to access U.S. export-controlled technology; employment may require qualifying citizenship or permanent residency status, or prior license approval.

Responsibilities

Assist with post-silicon testing of physical microchips under real-world workloads to verify functional, electrical, and performance specifications.
Contribute to foundational software development, including firmware, drivers, and operating systems that control and interface with semiconductor hardware.
Help define, map, and evaluate high-level system structures and interfaces.
Help optimize power delivery and high-speed performance benchmarks for silicon components and underlying PCBs.
Contribute to semiconductor packaging and mechanical design, including design and layout, electromagnetic signal- and power-integrity work, mechanical design, and stress analysis.