Systems Intern - Validation, Software, Design, Architecture & Packaging (USA)
About The Position
Tenstorrent is a leader in cutting-edge AI technology, aiming to revolutionize performance, usability, and cost-efficiency. As AI redefines computing, solutions must integrate innovations across software models, compilers, platforms, networking, and semiconductors. Our team has developed a high-performance RISC-V CPU from scratch and is passionate about building the best AI platform. We foster collaboration, curiosity, and a commitment to solving complex problems. We are expanding our team and seeking contributors at all levels. This role focuses on the entire system, from ensuring silicon boots and validates correctly to building the surrounding board, power, mechanical, thermal, packaging, and I/O components. Applicants will be matched to specific teams and locations after a single application and recruiter screen. The internship offers exposure to various specialized areas: * **Systems & Silicon Validation:** Post-silicon testing of physical chips and integrated systems to verify functional, electrical, and performance specifications. * **System Software:** Development of essential software, including firmware, drivers, and operating systems, for direct hardware control and interfacing. * **System Design:** Defining, integrating, and mapping hardware components like PCBs, software modules, and interfaces into a comprehensive product blueprint. * **System Architecture:** Establishing the high-level structural framework, interfaces, and data flow between the CPU, memory, and peripherals. * **Packaging:** Designing the interface between silicon and the board, involving detailed electrical, electromagnetic, mechanical simulations, and analysis.
Requirements
- Currently pursuing a BS, MS, or PhD in EE, Computer Engineering, Computer Science or Mechanical Engineering
- Coursework or projects in embedded systems, microwave and signal integrity, board-level design, or thermal/mechanical engineering using low-level programming (C/C++, Python) or hardware design and/or simulation tools (e.g., CAD, FEA, Verilog).
- Problem solver with strong foundational knowledge in one of these areas: electrical engineering, digital logic, computer architecture, or thermal/mechanical.
- Curious learner who is passionate about the intersection of software, silicon architecture, and the physical constraints of chip packaging and printed circuit boards (PCBs).
Responsibilities
- Assist in post-silicon testing of physical microchips under real-world workloads to ensure they meet all functional, electrical, and performance specifications.
- Contribute to developing foundational software—including firmware, drivers, and operating systems—that directly controls and interfaces with the semiconductor hardware.
- Help map out, define, and evaluate high-level structural frameworks, optimizing the power delivery and high-speed performance benchmarks of both the silicon components and the underlying PCBs.
- Design and layout, Electromagnetic (signal integrity and power integrity), mechanical design, and stress analysis.
Benefits
- Highly competitive compensation package
- Equal opportunity employer
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What This Job Offers
Career Level
Intern
