Micron Technology’s HBM Architecture team develops advanced datapath solutions for next-generation High Bandwidth Memory (HBM) products. The team works across design, PHY, ECC, verification, layout, and system groups to develop logic-die and core-die architectures from concept through production. The HBM Datapath Engineer will architect, design, and optimize high-speed datapaths for HBM products, focusing on logic-die and core-die circuitry. The role supports bandwidth, power efficiency, reliability, and scalability across JEDEC and custom HBM solutions, and contributes to designs from concept through silicon bring-up and production. The position also includes leveraging AI to efficiently execute regular work.
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Job Type
Full-time
Career Level
Senior