Micron Technology’s High Bandwidth Memory (HBM) Engineering team develops memory solutions for next-generation artificial intelligence, machine learning, and high-performance computing applications. The team works with global design, verification, validation, and product engineering organizations to develop semiconductor technologies for data centers and intelligent systems. As an HBM Design Engineer Intern, you will work alongside experienced engineers to support the design verification and validation of advanced HBM products. The internship offers hands-on experience with verification methodologies, simulation environments, debugging techniques, and semiconductor development processes. You will contribute to product development while building foundational skills in digital design, verification, and AI-supported computing technologies.
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Job Type
Full-time
Career Level
Intern