Micron Technology’s High Bandwidth Memory (HBM) Design team develops memory solutions for artificial intelligence, high-performance computing, graphics, and data center applications. The team works across Design, Verification, Physical Design, Product Engineering, and CAD organizations to deliver new memory technologies. The HBM Design Engineer Intern works with experienced engineers on the design, development, and validation of advanced HBM products. The internship offers hands-on experience with semiconductor design methodologies, industry-standard EDA tools, and AI-assisted engineering workflows while contributing to memory design projects in a collaborative global environment.
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Career Level
Intern