Intern - Memory Design Engineer, HBM

Micron•Richardson, TX

About The Position

Micron Technology’s High Bandwidth Memory (HBM) Design team develops memory solutions for artificial intelligence, high-performance computing, graphics, and data center applications. The team works across Design, Verification, Physical Design, Product Engineering, and CAD organizations to deliver new memory technologies. The HBM Design Engineer Intern works with experienced engineers on the design, development, and validation of advanced HBM products. The internship offers hands-on experience with semiconductor design methodologies, industry-standard EDA tools, and AI-assisted engineering workflows while contributing to memory design projects in a collaborative global environment.

Requirements

  • Currently pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
  • Completed coursework in Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices, or equivalent subjects.
  • Demonstrated understanding of combinational and sequential logic design concepts.
  • Familiarity with Verilog, SystemVerilog, or VHDL.
  • Programming experience in Python, Perl, Tcl, C/C++, or similar languages.
  • Strong analytical, debugging, problem-solving, communication, and teamwork skills.

Nice To Haves

  • Knowledge of memory architectures such as DRAM, SRAM, DDR, LPDDR, or HBM.
  • Experience with RTL design, simulation, synthesis, timing analysis, or verification methodologies through coursework, research, or internships.
  • Familiarity with Linux/Unix environments, scripting, and semiconductor EDA tools such as VCS, Xcelium, Questa, PrimeTime, Innovus, or Virtuoso.
  • Understanding of functional coverage, design verification concepts, and semiconductor development flows.
  • Previous academic, research, or internship experience involving VLSI, ASIC, FPGA, memory design, or the application of AI tools to enhance engineering productivity and analysis.

Responsibilities

  • Assist with HBM memory and logic design activities, including RTL development, circuit implementation, simulation, verification, and functional analysis.
  • Develop and use scripting, automation, and AI-assisted workflows to improve design productivity, debugging efficiency, and design-flow quality.
  • Perform timing, power, and functional analysis of HBM subsystems.
  • Support design reviews, technical investigations, and root-cause analysis, using AI-enabled engineering techniques where appropriate.
  • Collaborate with Design Verification, Physical Design, CAD, and Product Engineering teams to support project execution and product development.
  • Document technical work, experimental results, build methodologies, and AI-assisted insights to support collaboration and ongoing improvement.

Benefits

  • Choice of medical, dental, and vision plans.
  • Benefits to help protect income in the event of illness or injury.
  • Paid family leave.
  • Paid time off.
  • Paid holidays.
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