Design Lead (HBM/Advanced Memory Design)
About The Position
Micron Technology is seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive cross-functional collaboration across Design, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules. This role involves leading complex memory subsystems and top-level integration activities, owning design planning, technical decision-making, risk assessment, and schedule execution. The Design Lead will coordinate with various teams to ensure design quality and manufacturability, review design specifications, and drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities. They will also lead design reviews, mentor junior engineers, define and improve design methodologies using AI-enabled tools, and support silicon bring-up and debug activities. Communication of project status, risks, and mitigation plans to management and stakeholders is also a key part of the role.
Requirements
- BS/MS/PhD in Electrical Engineering, Computer Engineering, or related field.
- 8+ years of semiconductor design experience.
- Demonstrated experience leading complex IC development programs.
- Strong understanding of digital and/or custom circuit design methodologies.
- Experience with RTL design (Verilog/SystemVerilog)
- Experience with Timing closure and physical implementation concepts
- Experience with Verification and debug flows
- Experience with DFT and silicon validation
- Experience with Power, performance, and area optimization
- Strong communication, leadership, and project management skills.
Nice To Haves
- Experience with DRAM, DDR, HBM, LPDDR, or advanced memory products.
- Experience leading global cross-functional teams.
- Knowledge of advanced process nodes and design-for-manufacturing concepts.
- Experience with Synopsys and Cadence implementation flows.
- Familiarity with package integration, 2.5D/3D stacking, TSV, and advanced packaging technologies.
- Strong track record of successful product tape-outs.
Responsibilities
- Lead the design and execution of complex memory subsystems and top-level integration activities.
- Own design planning, technical decision-making, risk assessment, and schedule execution.
- Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability.
- Review design specifications, microarchitecture documents, and implementation plans.
- Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities depending on project needs.
- Lead design reviews and drive issue resolution across organizations.
- Mentor junior engineers and provide technical leadership to project teams.
- Define and improve design methodologies utilizing AI-enabled tools, automation, and best practices.
- Support silicon bring-up, debug, characterization, and yield improvement activities.
- Communicate project status, risks, and mitigation plans to management and stakeholders.
Benefits
- Choice of medical, dental and vision plans
- Benefit programs that help protect your income if you are unable to work due to illness or injury
- Paid family leave
- Robust paid time-off program
- Paid holidays
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What This Job Offers
Job Type
Full-time
Career Level
Senior
Education Level
Ph.D. or professional degree
