Intern - Memory Design Engineer, HBM

Micron Technology • Richardson, TX

2d

About The Position

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that power Artificial Intelligence (AI), high-performance computing, graphics, and data center applications. Our team collaborates across Design, Verification, Physical Design, Product Engineering, and CAD organizations to deliver next-generation memory technologies. As an HBM Design Engineer Intern, you will work alongside experienced engineers on the design, development, and validation of advanced HBM products. This internship provides hands-on experience with semiconductor design methodologies, industry-standard EDA tools, and AI-assisted engineering workflows while contributing to real-world memory design projects in a collaborative global environment.

Requirements

• Currently pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
• Completed coursework in Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices, or equivalent subjects.
• Demonstrated understanding of combinational and sequential logic design concepts and familiarity with Verilog, SystemVerilog, or VHDL.
• Programming experience in Python, Perl, Tcl, C/C++, or similar languages.
• Strong analytical, debugging, problem-solving, communication, and teamwork skills.

Nice To Haves

• Knowledge of memory architectures such as DRAM, SRAM, DDR, LPDDR, or HBM.
• Experience with RTL design, simulation, synthesis, timing analysis, or verification methodologies through coursework, research, or internships.
• Familiarity with Linux/Unix environments, scripting, and semiconductor EDA tools such as VCS, Xcelium, Questa, PrimeTime, Innovus, or Virtuoso.
• Understanding of functional coverage, design verification concepts, and semiconductor development flows.
• Previous academic, research, or internship experience involving VLSI, ASIC, FPGA, memory design, or the application of Artificial Intelligence (AI) tools to enhance engineering productivity and analysis.

Responsibilities

• Assist with HBM memory and logic design activities, including RTL development, circuit implementation, simulation, verification, and functional analysis.
• Develop and use scripting, automation, and AI-assisted workflows to improve design productivity, debug efficiency, and design-flow quality.
• Perform timing, power, and functional analysis of HBM subsystems and support design reviews, technical investigations, and root-cause analysis using AI-enabled engineering techniques where appropriate.
• Collaborate with Design Verification, Physical Design, CAD, and Product Engineering teams to support project execution and product development.
• Document technical work, experimental results, build methodologies, and AI-assisted insights to support collaboration and ongoing improvement.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Career Level: Intern
• Education Level: No Education Listed