Micron Technology’s High Bandwidth Memory (HBM) Design team develops memory solutions for AI, high-performance computing, graphics, and data-center applications. The HBM Design Engineer Intern works alongside experienced memory engineers on the design, development, and validation of advanced HBM products. The role offers hands-on experience with digital and circuit design, design verification, simulation, and semiconductor development flows, in collaboration with Design, Verification, Physical Design, Product Engineering, and CAD teams.
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Job Type
Full-time
Career Level
Intern
Education Level
No Education Listed