Sr BEOL Engineer - DRAM Process Integration

Micron • Boise, ID

1d

About The Position

Micron Technology is seeking a Sr BEOL Engineer to join its Research and Development back-end-of-line (BEOL) process-integration group. The role contributes to developing, refining, and delivering semiconductor process-integration flows for memory and storage technologies. The engineer works with technical specialists and cross-functional teams to maintain process quality and competitiveness, address integration challenges, and support technology development and production readiness.

Requirements

• Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Microelectronics, Physics, Chemistry, or a related area, with at least two years of proven experience; a PhD or equivalent experience in these subjects also qualifies if supported by relevant coursework or research related to thin films, interconnect technology, nanofabrication, or similar topics.
• Basic knowledge of semiconductor manufacturing techniques, including thin-film deposition, etch, lithography, and CMP.
• Familiarity with BEOL concepts, including metallization, interconnects, dielectrics, and barrier/liner films.
• Hands-on experience with one or more thin-film deposition or etch processes, such as chemical vapor deposition, atomic layer deposition, or physical vapor deposition.
• Experience with semiconductor device technologies and at least one of process integration, yield improvement, or reliability testing.

Nice To Haves

• Internship, cooperative-education, research, or work experience in a semiconductor fabrication or R&D environment.
• Ability to learn new technical concepts, adapt to changing project requirements, and prioritize multiple tasks.
• Experience with statistical-analysis tools such as JMP, Python, R, or equivalent software.
• Experience using or learning AI-enabled tools for engineering data analysis, technical research, workflow automation, or problem-solving.
• Familiarity with characterization techniques such as scanning electron microscopy, transmission electron microscopy, X-ray diffraction, or electrical testing.
• Experience with design-of-experiments methodology.
• Knowledge of semiconductor reliability principles such as electromigration, time-dependent dielectric breakdown, or stress migration.

Responsibilities

• Support the development, optimization, and integration of semiconductor process flows.
• Help resolve integration problems across process modules, including metallization, dielectrics, etch, and chemical-mechanical planarization.
• Collect, analyze, and interpret process and electrical data using AI-enabled modeling and analytical tools to identify patterns and anomalies and support yield and reliability improvements.
• Collaborate with module engineering, device engineering, reliability, and manufacturing teams to resolve technical challenges.
• Participate in process-transfer and production-readiness activities.
• Document technical findings and present results and recommendations to engineering teams and leadership.
• Learn and implement statistical analysis methods and software such as JMP, Python, R, or similar tools.
• Support semiconductor process-integration research and technology-development activities.

Benefits

• Choice of medical, dental, and vision plans.
• Programs that help protect income in case of illness or injury.
• Paid family leave.
• Paid time off.
• Paid holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior