Sr BEOL Engineer - DRAM Process Integration

Micron Technology•Boise, ID

About The Position

Micron Technology is hiring a Sr BEOL Engineer for its DRAM Process Integration group within Research and Development. The role contributes to developing, refining, and delivering semiconductor process-integration flows, helping maintain the quality and competitiveness of Micron’s processes. The engineer works with specialists across engineering and manufacturing to support process integration, technology development, production readiness, and improvements in yield and reliability. The work also includes analyzing process and electrical data, documenting findings, and presenting results and recommendations.

Requirements

Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Microelectronics, Physics, Chemistry, or a related area, with at least two years of proven experience; or a PhD or equivalent experience in these subjects supported by relevant coursework or research related to thin films, interconnect technology, nanofabrication, or similar topics.
Basic knowledge of semiconductor manufacturing techniques, including thin-film deposition, etch, lithography, and CMP.
Familiarity with BEOL concepts, including metallization, interconnects, dielectrics, and barrier/liner films.
Hands-on experience with one or more thin-film deposition or etch processes, such as chemical vapor deposition, atomic layer deposition, or physical vapor deposition.
Experience with semiconductor device technologies and with at least one of process integration, yield improvement, or reliability testing.

Nice To Haves

Internship, cooperative-education, research, or work experience in a semiconductor fabrication or R&D environment.
Ability to learn new technical concepts, adapt to changing project requirements, and prioritize multiple tasks.
Experience with statistical-analysis tools such as JMP, Python, R, or equivalent software.
Experience using or learning AI-enabled tools to support engineering data analysis, technical research, workflow automation, or problem-solving.
Familiarity with characterization techniques such as scanning electron microscopy, transmission electron microscopy, X-ray diffraction, or electrical testing.
Experience with design-of-experiments methodology.
Knowledge of semiconductor reliability principles such as electromigration, time-dependent dielectric breakdown, or stress migration.

Responsibilities

Support the development, optimization, and integration of semiconductor process flows.
Help resolve integration problems across process modules, including metallization, dielectrics, etch, and chemical-mechanical planarization.
Collect, analyze, and interpret process and electrical data, using AI-enabled modeling and analytical tools to identify patterns and anomalies and support yield and reliability improvements.
Collaborate with module engineering, device engineering, reliability, and manufacturing teams to resolve technical challenges.
Participate in process-transfer and production-readiness activities.
Document technical findings and present results and recommendations to engineering teams and leadership.
Learn and implement statistical analysis methods and software such as JMP, Python, R, or similar tools.
Support semiconductor process-integration research and technology-development activities.