About The Position

Majestic Labs is a fast-moving US-Israeli AI startup building custom AI servers for demanding inference and training workloads. The company is seeking a Senior Signal Integrity (SI) and Power Integrity (PI) Engineer to own end-to-end electrical link performance across high-speed interconnects, from architecture and pre-silicon modeling through silicon bring-up, validation, and high-volume manufacturing. This is a hands-on technical role for an engineer with experience taking multiple products from concept to production and addressing issues that arise in volume manufacturing.

Requirements

  • 10+ years of hands-on SI/PI engineering experience in the semiconductor, systems, or networking hardware industry.
  • Demonstrated experience across the full product lifecycle, from architecture through production and sustained high-volume manufacturing; simulation-only experience is not sufficient.
  • Deep working knowledge of high-speed SerDes signaling, including 224G or comparable leading-edge electrical interfaces, and PCIe link architecture.
  • Solid experience with parallel/source-synchronous interfaces such as DDR/memory buses and chip-to-chip interconnects.
  • Proficiency with COM-based analysis and IBIS-AMI modeling for channel compliance and margin assessment.
  • Strong command of industry-standard tools: Ansys HFSS, Ansys PowerSI or equivalent 2.5D/3D field solvers, Keysight ADS, and MATLAB.
  • Hands-on proficiency with SI/PI lab testing and validation equipment, including VNAs for S-parameter extraction, TDR/TDT for impedance and discontinuity characterization, and oscilloscopes for eye diagram, jitter, and signal quality measurement.
  • Familiarity with power integrity fundamentals, including PDN impedance analysis, decoupling strategy, DC/AC drop, and chip-package-board co-design.
  • Experience working with cross-functional teams, including ASIC design, package engineering, PCB layout, test/ATE, and manufacturing, to drive designs to closure.
  • Excellent written and verbal communication skills, with the ability to clearly present technical risks and trade-offs to engineering and program stakeholders.

Nice To Haves

  • Experience with additional high-speed standards such as CXL and Ethernet SerDes.
  • Scripting or automation experience with Python for simulation flow automation or data analysis.
  • Experience with connector, cable, or optical module electrical characterization.
  • Familiarity with signal/power co-simulation and chip-package-system (CPS) modeling flows.
  • Exposure to compliance testing and industry standards bodies such as PCI-SIG, OIF-CEI, and JEDEC.

Responsibilities

  • Own signal integrity and power integrity analysis for end-to-end high-speed links, including package, connector, PCB, and cable interconnects.
  • Drive SI/PI closure for high-speed SerDes interfaces (112G/224G-class), PCIe (Gen5/Gen6+), and parallel or single-ended interfaces such as DDR/LPDDR memory and chip-to-chip links.
  • Perform pre-silicon channel modeling, budgeting, and margin analysis using COM, IBIS-AMI, and statistical eye methodologies.
  • Build and correlate 3D/2.5D EM models using HFSS and PowerSI against lab measurements using VNA, TDR, BERT, and oscilloscopes to validate channel and package performance.
  • Perform system-level PDN analysis, develop decoupling strategies, and conduct power/SI co-design across chip, package, and board.
  • Use ADS and MATLAB for circuit-level simulation, link budget analysis, and custom post-processing or automation of simulation and lab data.
  • Support silicon bring-up, debugging, and characterization in the lab; identify root causes of SI/PI-related failures and drive corrective actions.
  • Partner with ASIC, package, PCB layout, and mechanical teams to define design rules, stackups, routing guidelines, and connector and material selection.
  • Lead products through DVT/PVT and into high-volume manufacturing, including establishing test limits, correlating ATE/system-level test data to simulation, and resolving field or yield issues related to SI/PI margin.
  • Contribute to internal methodology, tooling, and design guideline development.
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