Cisco Silicon One is seeking a Signal and Power Integrity Technical Leader to develop next-generation ASIC packaging and lead the Silicon Packaging Signal and Power Integrity Team. The team defines, designs, and verifies ASIC packaging for use across Cisco platforms, working with advanced IC package designs and heterogeneous system integration, including 2.5D fanout technologies. The role develops and implements design rules for ultra-high-speed signaling and analyzes substrate signal and power integrity. It collaborates with layout teams, system partners, vendors, and design leads to optimize interposer, substrate, and PCB solutions; resolve complex technical issues; and deliver high-volume, high-quality ASIC packages. The Technical Leader also defines processes, methods, and tools for complex ASIC/package development, contributes to chip architecture and design reviews, mentors engineers, and promotes design reviews, postmortems, and continuous improvement.
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Job Type
Full-time
Career Level
Senior