Distinguished Signal and Power Integrity Engineer
About The Position
NVIDIA is seeking a Distinguished Signal and Power Integrity Engineer to lead corporate-level strategies and technical direction for high-speed signaling across advanced semiconductor packaging, sockets, and connectors. The role supports next-generation products ranging from ultra-mobile systems to high-performance AI and HPC platforms, and involves architecting interconnect and packaging solutions for standards and technologies including UCIe, HBM, DDR, PCIe, and 224G/448G SerDes. The engineer will enable advanced packaging solutions for co-packaged optics, stacked die, chiplet-based architectures, and IVR solutions. The position also covers development of modeling and characterization flows, flow automation, and design-for-high-volume-manufacturing techniques. As a recognized subject matter expert, the successful candidate will advise senior leadership on emerging technologies, investment, and research priorities in signaling, packaging, and system integration.
Requirements
- 15+ years leading innovations in high-speed signal integrity, computational electromagnetics, and semiconductor assembly technologies.
- MS or PhD in Electrical Engineering or equivalent, with 15+ years of industry experience.
- Hands-on invention and deployment of advanced solutions such as EMIB, UCIe, CPO, or high-density connectors.
- Deep experience in electrical, computer, and packaging engineering and deployment of these technologies in products.
- Demonstrated ability to manage and mentor highly skilled engineering teams, define methodologies, and deliver complex projects from research to high-volume manufacturing.
Nice To Haves
- Proven track record as an industry veteran bringing advanced signal-integrity concepts from research to product.
- Recognition as a pioneer in an industry-standard high-speed signaling technology.
- Deep knowledge of the operation and manufacturing challenges of package substrate, PCB, cables, and connectors.
Responsibilities
- Lead development and execution of corporate-level strategies for high-speed signaling technologies across advanced semiconductor packaging, sockets, and connectors.
- Oversee technical direction and implementation for next-generation products, from ultra-mobile to high-performance AI and HPC platforms.
- Architect and deliver interconnect and packaging solutions for UCIe, HBM, DDR, PCIe, and 224G/448G SerDes.
- Enable advanced packaging solutions for co-packaged optics, stacked die, chiplet-based architectures, and IVR solutions.
- Develop modeling and characterization flows, flow automations, and design-for-high-volume-manufacturing techniques.
- Provide strategic counsel to senior leadership on emerging technologies, technology investment, and research priorities in signaling, packaging, and system integration.
- Manage and mentor highly skilled engineering teams, define methodologies, and deliver complex projects from research through high-volume manufacturing.
Benefits
- Equity
- Benefits
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Job Type
Full-time
Career Level
Principal
