Senior RF Engineer [651]

D-Wave Quantum•New Haven, CT

About The Position

D-Wave is seeking a Senior RF Engineer to join its Quantum Design and Architecture Group (QDAG), a multidisciplinary team developing architecture and hardware for next-generation quantum systems. The position combines quantum device integration with the design of RF and microwave components used to operate quantum systems. The engineer will design, simulate, test, and characterize microwave components and circuits, support PCB design and procurement for system-level integration, and collaborate with quantum device engineers on cryogenic-compatible RF interfaces. Experience designing and testing microwave hardware for cryogenic systems is a strong plus.

Requirements

  • At least 5 years of industry experience.
  • MS or Ph.D. in Electrical Engineering, Physics, or a related field.
  • Solid understanding of RF/microwave engineering principles, including impedance matching, S-parameters, signal routing, and noise analysis.
  • Hands-on experience testing and measuring RF systems, including network/spectrum analysis, time-domain reflectometry, and de-embedding techniques.
  • Proficiency with simulation and layout tools such as Keysight ADS, Cadence AWR, Ansys HFSS, Ansys Maxwell, Ansys Q3D Extractor, Altium Designer, Cadence Allegro, or KiCad.
  • Experience programming in Python or similar languages.

Nice To Haves

  • Experience designing and testing microwave hardware for cryogenic systems.

Responsibilities

  • Design, simulate, and optimize RF/microwave components and PCB layouts for RF and DC circuits, with attention to high-frequency performance and thermal reliability.
  • Work with vendors to manufacture and procure microwave components and integrated PCBs.
  • Develop RF integrated circuits (RFICs) using D-Wave's fabrication stack.
  • Test and characterize microwave circuits using VNAs, spectrum analyzers, and other lab equipment at room and cryogenic temperatures.
  • Collaborate with quantum device engineers to design RF interfaces compatible with cryogenic packaging and interconnects, integrating RF subsystems with quantum processors.
  • Document designs, test procedures, and experimental data for cross-functional use and iterative improvement.

Benefits

  • Company ownership/equity.
  • Competitive pay.
  • Bonus.
  • Perks and benefits; specific offerings are reviewed by the recruiter during the interview process.
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