About The Position

The Process Integration and Technology Development Engineer defines, develops, and implements silicon process technology for manufacturing integrated silicon devices. The role covers unit and process module development, process flow implementation, design rule definition, device architecture, electrical characterization, and technology qualification. This work supports new silicon technology development and transfers of existing technologies into and out of the resident fab. Experience related to semiconductor processing in BCD, Discretes, and hybrid Smart Power technologies is desired. The position also supports manufacturing quality, yield, reliability, and manufacturability through process improvements, corrective actions, root-cause analysis, data mining, and data-driven technology transfer monitoring.

Requirements

  • MS or PhD in Electrical Engineering, Physics, Chemistry, Chemical Engineering, Materials Engineering, or a related technical field.
  • Knowledge of semiconductor device physics and construction, including CMOS, DMOS, Bipolar, and Trench FET devices.
  • Strong written and verbal communication skills, with the ability to convey complex technical concepts clearly.
  • Demonstrated problem-solving ability and strong collaboration skills in cross-functional teams.

Nice To Haves

  • Experience related to semiconductor processing in BCD, Discretes, and hybrid Smart Power technologies.
  • Understanding of semiconductor processes such as CVD, PVD, implant, diffusion, etch, and plating.
  • Hands-on experience with process and device TCAD simulations.
  • Experience designing and evaluating experiments using statistical methods.
  • Familiarity with AI/ML techniques, data mining, or statistical modeling.
  • Experience using scripting languages such as Python, MATLAB, JMP, or equivalent for data analysis, automation, or model development.

Responsibilities

  • Lead development of unit processes and process modules for CMOS, BCD, Discretes, and hybrid Smart Power technologies.
  • Define and assess process module characterization to ensure robustness, manufacturability, and scalability.
  • Develop and maintain end-to-end technology process flows with detailed process specifications.
  • Define physical design rules and test structures for characterization.
  • Drive process and device optimization to meet performance, reliability, and cost targets.
  • Design and analyze statistical experiments using DOE, regression, and AI-assisted methods to optimize device architecture and process modules.
  • Support intrinsic reliability studies, including gate oxide integrity, TDDB, HCI, EM, and stress migration, using physics-based and data-driven approaches.
  • Facilitate process improvements and corrective actions for yield, reliability, and manufacturability issues using root-cause analysis and data mining and analysis.
  • Support Process Engineering and Yield Engineering teams to improve process quality and yield for technologies released to manufacturing.
  • Enable smooth technology transfers into and out of the fab using data-driven monitoring, excursion detection, and learning systems.
© 2026 Teal Labs, Inc
Privacy PolicyTerms of Service