Principal Foundry Interface Design Engineer, HBM
About The Position
The HBM Design Architecture team within Micron’s HBM DRAM Engineering Group works across design, technology, and manufacturing to develop next-generation HBM solutions. In this full-time, onsite role, the engineer provides technology support for the design and development of advanced HBM DRAM products, bridging internal design teams, foundries, and technology development groups to translate advanced process capabilities into scalable, high-performance architectures. The work affects product performance, power efficiency, reliability, and the long-term HBM roadmap. The role also supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Candidates are expected to demonstrate proven experience in at least three of the five focus areas: foundry interface and technology alignment; circuit simulation and analysis; test-chip and silicon validation; PDK and design enablement; and AI-enabled productivity and efficiency improvement.
Requirements
- BS, MS, PhD, or equivalent experience in Electrical Engineering, Computer Engineering, or a related field.
- At least 5 years of semiconductor industry experience.
- Solid understanding of advanced semiconductor technology development.
- Strong grasp of advanced CMOS technology nodes, FinFET devices, and process integration.
- Hands-on experience with HSPICE simulations, device characterization, standard cell benchmarking, PPA analysis, parasitic extraction, and physical verification.
- Experience driving AI-enabled engineering practices and automation to improve efficiency in DTCO analysis, foundry collateral evaluation, PDK enablement, benchmarking, and collaboration across build teams.
- Proven experience in at least three of the five focus areas: foundry interface and technology alignment; circuit simulation and analysis; test-chip and silicon validation; PDK and design enablement; and AI-enabled productivity and efficiency improvement.
Nice To Haves
- Experience working directly with leading foundries such as TSMC, Samsung, Intel Foundry Services, or GlobalFoundries.
- Experience with memory products, including DRAM, HBM, or SRAM.
- Knowledge of TSV technologies, advanced packaging, reliability modeling and aging simulations, advanced BEOL technologies, and PDK development and validation.
- Ability to apply AI tools to summarize, analyze, and extract insights from PDK documentation, Design Rule Manuals, reliability reports, foundry collateral, and silicon characterization data.
- Experience leading technology pathfinding and node selection activities.
Responsibilities
- Support design and development of advanced HBM DRAM products through technology expertise.
- Bridge internal design teams, foundries, and technology development groups.
- Translate advanced process capabilities into scalable, high-performance architectures.
- Contribute to foundry interface and technology alignment.
- Perform circuit simulation and analysis.
- Support test-chip and silicon validation.
- Contribute to PDK and design enablement.
- Drive AI-enabled productivity and efficiency improvements, including engineering practices and automation for DTCO analysis, foundry collateral evaluation, PDK enablement, benchmarking, and collaboration across build teams.
Benefits
- Medical, dental, and vision plans.
- Income-protection benefit programs for illness or injury.
- Paid family leave.
- Paid time off.
- Paid holidays.
- Additional compensation may include bonuses and equity.
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What This Job Offers
Job Type
Full-time
Career Level
Principal
