Senior | Principal Foundry Interface Design Engineer - HBM- TPG
About The Position
Micron’s HBM Design Architecture team, within the HBM DRAM Engineering Group, works across design, technology, and manufacturing to deliver next-generation HBM solutions. In this full-time, onsite role, the engineer provides technology support for the design and development of advanced HBM DRAM products and serves as a bridge between internal design teams, foundries, and technology development groups. The work translates advanced process capabilities into scalable, high-performance architectures and affects product performance, power efficiency, reliability, and long-term HBM roadmap success. The role also supports AI-enabled solutions intended to improve efficiency and decision-making. Candidates are expected to demonstrate proven experience in at least three of the five focus areas: foundry interface and technology alignment; circuit simulation and analysis; test-chip and silicon validation; PDK and design enablement; and AI-enabled productivity and efficiency improvement.
Requirements
- BS, MS, PhD, or equivalent experience in Electrical Engineering, Computer Engineering, or a related field.
- At least 5 years of semiconductor industry experience.
- Solid understanding of advanced semiconductor technology development.
- Strong grasp of advanced CMOS technology nodes, FinFET devices, and process integration.
- Hands-on experience with HSPICE simulations, device characterization, standard cell benchmarking, PPA analysis, parasitic extraction, and physical verification.
- Experience driving AI-enabled engineering practices and automation to improve the efficiency of DTCO analysis, foundry collateral evaluation, PDK enablement, benchmarking, and collaboration across build teams.
- Proven experience in at least three of the five focus areas listed for the role.
Nice To Haves
- Experience working directly with leading foundries such as TSMC, Samsung, Intel Foundry Services, or GlobalFoundries.
- Experience with memory products, including DRAM, HBM, or SRAM.
- Knowledge of TSV technologies, advanced packaging, reliability modeling and aging simulations, advanced BEOL technologies, and PDK development and validation.
- Ability to apply AI tools to summarize, analyze, and extract insights from PDK documentation, Design Rule Manuals (DRMs), reliability reports, foundry collateral, and silicon characterization data.
- Experience leading technology pathfinding and node selection activities.
Responsibilities
- Provide technology support for the design and development of advanced HBM DRAM products.
- Bridge internal design teams, foundries, and technology development groups.
- Translate advanced process capabilities into scalable, high-performance architectures.
- Support AI-enabled solutions that improve efficiency and decision-making.
- Demonstrate experience in at least three of these focus areas: foundry interface and technology alignment; circuit simulation and analysis; test-chip and silicon validation; PDK and design enablement; and AI-enabled productivity and efficiency improvement.
Benefits
- Choice of medical, dental, and vision plans.
- Programs that help protect income in the event of illness or injury.
- Paid family leave.
- Paid time-off program.
- Paid holidays.
- Additional compensation may include benefits, bonuses, and equity.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
