Principal Engineer-Yield Enhancement
About The Position
The Principal Engineer is a semiconductor wafer fab device engineer with product and technology yield responsibility. The role determines causes of low yields at parametric and wafer sort test, introduces new products into production, supports product and process transfers, and continuously improves product yields and reliability. The position works with wafer fab process, product, design, and test engineering teams to analyze production and engineering data, plan and evaluate process experiments, identify failures, and drive yield improvement. It also supports new product and process-flow introductions into the fab and parametric test area, including transfers from other facilities.
Requirements
- Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Microelectronics, or a related field.
- At least 10 years of relevant experience in semiconductor yield analysis and enhancement, defect and excursion reduction, process and product correlation, data analytics, root-cause investigation, corrective action, production learning, and continuous improvement.
- Knowledge of basic semiconductor device physics and electronics, including transistor characteristics.
- Understanding of basic digital and analog circuits, their components, and how they are characterized.
- Overall knowledge of integrated circuit wafer fab manufacturing processes.
- Familiarity with test equipment such as semiconductor parameter analyzers, power supplies, multimeters, generators, oscilloscopes, and curve tracers.
- Knowledge of basic statistical functions and SPC, including normal distributions, Cpk, analysis of variance, and correlation techniques.
- Ability to present information effectively, both orally and in writing, to management and employees.
- Understanding of probability, geometry, algebra, trigonometry, and calculus.
- Ability to define problems, collect data, establish facts, draw valid conclusions, solve problems, and help drive improvement activities.
Nice To Haves
- Master’s degree or PhD in Electrical Engineering, Physics, Microelectronics, or a related field.
- Relevant professional certification where job-related and approved.
Responsibilities
- Work with wafer fab process engineering, product engineering, design engineering, and test engineering to identify issues and opportunities and drive yield improvements.
- Analyze production and engineering data to identify and resolve product yield issues.
- Design, coordinate, and analyze IC manufacturing process experiments to improve product yields and performance.
- Evaluate the parametric and product impact of process experiments.
- Use evaluation equipment to collect engineering data, perform failure analysis, and detect circuit or fabrication problems causing failures.
- Disposition maverick material at parametric test and wafer sort.
- Own product and technology responsibilities, including maintenance of yield limits, process change control, new product introduction, and yield improvements.
- Support new product and process-flow introductions into the fab and parametric test area by creating, reviewing, and implementing supporting specifications and process routes and flows; this may include transfers from other facilities.
- Plan and complete technical projects.
- Communicate regularly with management and other Microchip functional groups about needs and problems related to Yield Engineering.
Benefits
- Competitive base pay, restricted stock units, and quarterly bonus payments.
- Health benefits beginning on day one.
- Retirement savings plans.
- Employee stock purchase plan with a two-year look-back feature.
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What This Job Offers
Job Type
Full-time
Career Level
Principal
