Principal DRAM Process Pathfinding - Dry Etch

Micron Technology • Boise, ID

2d

About The Position

Micron Technology is seeking a senior semiconductor process engineer to lead dry etch process development and help shape process and technology roadmaps for current and future technology nodes. The role applies deep expertise in plasma etch technology to cross-functional engineering efforts, mentors engineers, and drives solutions to complex process, defect, and equipment challenges.

The position works collaboratively with process integration, equipment, and adjacent process areas to advance dry etch technologies and address semiconductor manufacturing challenges. It also involves communicating project status and impacts to leadership and collaborating with equipment vendors.

Requirements

• MS, PhD, or equivalent experience, with more than 10 years of applicable semiconductor process engineering experience.
• Experience developing dry etch processes in a research and development environment.
• Experience with both inductively coupled plasma (ICP) and capacitively coupled plasma (CCP) tools, and knowledge of dry etch reactor technologies, including RF sources and chemistries.
• Knowledge of plasma physics, transport phenomena, or surface phenomena gained through professional experience or coursework.
• Demonstrated experience leading technical projects or engineering teams and solving complex process, defect, or equipment problems.

Nice To Haves

• Experience with advanced CMOS and DRAM technologies and statistical process control and analysis.
• Experience managing equipment vendor relationships and driving vendors toward technical solutions.
• Experience collaborating across process areas and developing knowledge of adjacent process technologies or hardware.
• Experience using AI-assisted analytics to enhance data interpretation, anomaly detection, and yield improvement initiatives.
• Strong computer skills, including Microsoft Office.

Responsibilities

• Lead development and optimization of dry etch processes to meet structural and electrical specifications.
• Partner with process integration and other engineering teams to influence integration flows, specifications, and technology roadmaps.
• Lead cross-functional teams and technical task forces to resolve complex structural, process, defect, and hardware challenges.
• Develop and present process and technology roadmaps for current and future technology nodes, and communicate project status and impacts to leadership.
• Serve as a technical resource and mentor for dry etch engineers.
• Collaborate with equipment vendors and adjacent process areas to drive solutions.

Benefits

• Choice of medical, dental, and vision plans.
• Programs that help protect income if unable to work due to illness or injury.
• Paid family leave.
• Paid time off.
• Paid holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal